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NXP Semiconductors
Posted 2mo ago

<2026 Internship Program> Process Engineer Intern (Wire Bonding)

NXP Semiconductors
Kaohsiung, Kaohsiung, Taiwan
OnsiteFull Time, Internship
Responsibilities
  • supporting operations
  • assisting monitoring
  • improving yield
Requirements
  • Bachelor's or Master's student in materials/science/electronic engineering or related
  • Understanding of plasma cleaning for wire bonding
  • Available ≥3 days/week
  • English proficiency
  • Microsoft Office or programming skills
  • Self-motivated and proactive
Technical tools mentioned
Microsoft Office

Job description

  • To work with operation/maintenance to ensure production smoothly.
  • To assist action confirmations with system monitors.
  • To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.

Job Qualification:

  • Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
  • Bachelor's or Master's student in Material/Science/Electronic Engineering or related
  • Available to work at least 3 days/week.
  • Good verbal and written English communication skills
  • MS Office or Programming skill
  • Self-motivated, results oriented, willing and eager to learn, proactive attitude


More information about NXP in Greater China...

#LI-2370

About NXP Semiconductors

Designs and manufactures semiconductors for automotive and IoT applications.

This job has expired