Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products.
In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.

We're looking for someone who:
• Has deep expertise in semiconductor packaging or related disciplines
• Thrives on solving difficult technical problems
• Holds themselves to a high standard of engineering excellence
• Is self-motivated and comfortable navigating ambiguity

Minimum Qualifications

• BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications

• PhD and 6+ years of experience in relevant industry preferred.
• Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
• Deep knowledge of electrical, mechanical and thermal properties of fab materials.
• Strong expertise in Si Fab equipment and Fab Logistics Management.
• Experience on advanced packaging for groundbreaking CMOS nodes.
• Expertise on Si structure yield and reliability mechanisms and analyses.
• Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
• Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
• Capable of independent R&D Work in a cross-functional team, driving vendors.
• Excellent communication skills.
• Experience in Si fab integration role and advanced packaging.