OUR STORY

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. 

When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!

Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential. 

YOUR ROLE

This position will closely cooperate with OSAT,  Division and R&D team, mainly focusing on new product development and smooth production

- Deploy technical requirements on new subcontractors

- Define critical process characteristics with subcons to fit product characteristics defined by internal customers

- Yield improvement and process improvement projects

- Involve in package maturity (NPI)

- Involve in automotive readiness project

- Develop workable system and template (when there is no ST format)

- Deploy ST technical projects (Inkless Map, STIF, ULT)

- Manage change management

- Package roadmap benchmarking

YOUR SKILLS & EXPERIENCES

• Bachelor's degree or above
• > 8 years relevant experience in Semiconductor
• Proficient in Semiconductor assembly processes
• Experienced in APQP, SPC, FMEA, DOE, 8D, SPC, etc
• Good problem solving, statistical analyst and project management skills
• Able to manage complex technical problems independently
• Good communication skills in both verbal and written English
• Experienced in MS software

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!

To discover more, visit st.com/careers