OUR STORY
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
This position will closely cooperate with OSAT, Division and R&D team, mainly focusing on new product development and smooth production
- Deploy technical requirements on new subcontractors
- Define critical process characteristics with subcons to fit product characteristics defined by internal customers
- Yield improvement and process improvement projects
- Involve in package maturity (NPI)
- Involve in automotive readiness project
- Develop workable system and template (when there is no ST format)
- Deploy ST technical projects (Inkless Map, STIF, ULT)
- Manage change management
- Package roadmap benchmarking
YOUR SKILLS & EXPERIENCES
- Bachelor's degree or above
- > 8 years relevant experience in Semiconductor
- Proficient in Semiconductor assembly processes
- Experienced in APQP, SPC, FMEA, DOE, 8D, SPC, etc
- Good problem solving, statistical analyst and project management skills
- Able to manage complex technical problems independently
- Good communication skills in both verbal and written English
- Experienced in MS software
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!
To discover more, visit st.com/careers
