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Posted 2mo ago

IC Packaging Engineer, Materials and Packaging Characterization

@ Apple
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United States
OnsiteFull Time
Responsibilities:characterize materials, evaluate packaging, develop methodologies
Requirements Summary:Bachelor's degree; 3+ years preferred in materials science, mechanical engineering, or physics; experience in experimental mechanics, material characterization, and packaging materials.
Technical Tools Mentioned:SEM, EDX, FIB, CSAM, MATLAB, Python
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Job Description

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products.

Description

As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.

Minimum Qualifications

  • Minimum requirement of a bachelors degree

Preferred Qualifications

  • BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred
  • Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.
  • Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).
  • Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python. Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.
  • Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.
  • Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.