Job Description

1. New Product risk assessment for 2.5D/3D/CPO advanced package & Board level qualification
2. Substrate electrical & physical analysis for Advanced Package
3. New product reliability concern engagement with customer
4. New assembly SBT supplier audit & qualification
5. Assembly supplier SBT quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)
6. New product/technology introduction quality & reliability management
7. Assembly SBT supplier quality improvement project

Main Requirements and Qualifications

1. 1. MS degree (or above) in Material Science or Engineering.
2. 2. Familiar with Assembly substrate processes.
3. 3. Familiar with problem solving and 8D CAR methodology
4. 4. VQA/IQA or MQR related experience
5. 5. Package Substrate & Board level reliability qualification experience