Your Tasks:
- You will work on complex bonding tasks in the field of microelectronic packaging
- You will develop customer-specific solutions through to process integration
- You will provide technical advice to our demanding customers at home and abroad
- You implement technologies in the production process of the respective customer in cooperation with sales and product management
- You carry out feasibility studies and derive the necessary consequences
- You have knowledge of the current state of the art and continue to expand your technical expertise
Your Skills:
- Degree in engineering in the field of microelectronics, physics, semiconductor technology, electrical engineering, materials science, etc.
- Several years of professional experience in project work and / or project management in the field of semiconductor packaging
- Enthusiasm for the engineering development of process solutions in semiconductor technology
- An analytical and cross-departmental way of thinking, initiative, ability to work in a team and very good organizational skills
- Willingness to travel internationally to visit customers and work with our colleagues abroad
- Very good command of written and spoken English
Your Benefits:
Job security with a global employer
Strong team spirit with team events, company outings and Christmas parties
Plenty of room for growth, working in rapidly growing and innovative markets
30 days vacation, flexible hours and working from home options
Opportunities for development thanks to continuous growth and our DELO Academy
Voluntary social benefits such as special payments, allowances for travel and dining
State-of-the-art office and laboratory buildings with a campus atmosphere
Mental health and fitness programs
