Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
8+ YOEMaster's in engineering or related plus 8+ years in semiconductor package thermal/thermomechanical analysis; experience with Ansys/Abaqus/COMSOL and Python; reliability statistics and failure analysis skills.
Northrop GrummanNYSE: NOC: Develops and manufactures advanced aerospace, defense, and space systems.
2+ YOESTEM bachelor's degree with 2–5 years relevant experience, or advanced STEM degree; Hypermesh, Nastran, Abaqus, and MATLAB experience; U.S. citizenship; ability to obtain Secret clearance.
Joby AviationNYSE: JOBY: Manufacturer of electric vertical takeoff and landing aircraft.
3+ YOEBachelor's in aerospace or mechanical engineering, 3+ years in structural loads or aeroelasticity, proficiency with NASTRAN/Abaqus/ZONA, MATLAB/Python, Linux/HPC, and strong problem-solving for flight test support.
ArcherNYSE: ACHR: Develops electric vertical takeoff and landing aircraft for urban mobility.
6+ YOEBachelor's in Aerospace or Mechanical Engineering required (Master's/PhD alternative). Minimum 6 years' experience in composite and metallic static and fatigue analysis, design and instrumentation engineering; experience with CATIA V5 and Abaqus preferred.
Engineering Consultant – ASME Section III, Division 5
Denver or San Jose or Huntersville
$97k-$171k/yrHybridFull Time
Structural Integrity Associates: Provides specialized engineering and inspection services for critical infrastructure.
6+ YOEBS in Mechanical or Materials Engineering, 6+ years experience with ASME Section III Division 5, high-temperature/creep-fatigue analysis, FEA (ANSYS,Abaqus), NRC knowledge, strong communication; MS and PE preferred.
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
3+ YOESTEM degree with 3–8 years experience (depending on degree), US citizenship, ability to obtain Secret clearance, experience with finite element modeling and analysis, and proficiency with NX, Hypermesh, Nastran, Abaqus, MATLAB, and Microsoft Excel.
NX, Hypermesh, Hyperview, MATLAB, Nastran, Abaqus, Microsoft Excel
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
6+ YOEMaster's or higher in engineering-related field preferred; 5+–6+ years FEA experience (min), strong structural mechanics and dynamics background, proficiency with ANSYS/ABAQUS/HyperMesh, experience correlating FEA with test data, strong communication.
Dexmate: Building AI-powered mobile humanoid robots for industrial automation.
3+ YOE3+ years FEA/CAE experience with strong solid mechanics and structural dynamics background; proficiency in FEA tools, implicit/explicit analysis, experimental validation, and cross-functional collaboration.
Hark: An artificial intelligence building advanced personalized intelligence paired with next-generation hardware.
8+ YOE8+ years FEA and structural simulation experience; expertise in structural, thermal, and dynamic analysis; proficiency with major FEA platforms and 3D CAD; strong solid mechanics and materials knowledge.
Atomic Machines: Develops AI-powered robotic platforms for autonomous micro-scale manufacturing.
5+ YOE5+ years relevant industry experience or related PhD; DFM coding experience; computational geometry; Python and a systems language; geometry kernel APIs; and a relevant engineering, computer science, math, or design degree.
Lockheed MartinNYSE: LMT: Designs and manufactures advanced aerospace, defense, and security systems.
5+ YOERequires structural dynamics knowledge, finite element analysis, NX/NASTRAN or equivalent, missile or spacecraft experience, U.S. citizenship, and active Secret clearance; 5+ years and master's degree preferred.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
12+ YOEBS/MS/PhD in Materials Science, Mechanical, Electrical, Physics or related; 12+ years IC packaging/NPI experience; knowledge of flip-chip, 2.5D/3D, wire bonding; FA and prototyping experience.
Samsung SemiconductorKorea Exchange: 005930: Designs and manufactures memory chips, processors, and sensors.
3+ YOEPhD in engineering discipline, 3+ years modeling/simulation experience in semiconductors, expertise in mechanical/thermal modeling, strong technical writing and collaboration skills.
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
5+ YOEBachelor's degree in mechanical engineering or related field with 5 years' experience, or master's/PhD with 3 years. Requires mechanical analysis, FEA, 3D CAD, prototyping, GD&T, and reliability/manufacturability knowledge.
Lithium Power: Custom-designed lithium battery and energy storage solutions.
3+ YOEB.S. in Mechanical Engineering or technical diploma with equivalent experience, 3+ years mechanical design, 3D CAD proficiency, 2D drawing and GD&T knowledge, fabrication/manufacturing understanding, and strong communication.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOE12+ years IC packaging development/NPI experience; degree in materials/mechanical/electrical/physics or equivalent; deep packaging expertise; familiarity with FA tooling and EDA/FEM tools.