13 advanced packaging technology development engineer jobs at 5 companies in United States
5d
Save
Mark Applied
Hide
Sr Advanced Packaging Technology Development Engineer, Bonding process
Taichung or United States or Japan or Singapore
OnsiteFull Time
2+ YOEMaster's degree or higher in chemistry, physics, materials, or related engineering; 2+ years of bonding experience; knowledge of advanced bonding technologies and mechanisms; fluent English and Chinese.
SUSS, EVG, TEL
2mo
Save
Mark Applied
Hide
Advanced Packaging Engineer
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yr OnsiteFull Time
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
5d
Save
Mark Applied
Hide
Sr Advanced Packaging Technology Development Engineer, FILM process
Taichung City or United States or Japan or Singapore
OnsiteFull Time
3+ YOEMaster's degree or higher in chemistry, physics, materials, or engineering science; 3+ years of CVD/PVD thin-film experience; thin-film deposition expertise; fluent English and Chinese.
CVD, PVD, AMAT, LAM, TEL
1w
Save
Mark Applied
Hide
Senior Director, Optical Packaging Technology (OPT) Development
Malta or Essex Junction or Burlington or Egypt or India or Singapore
$198k-$333k/yr OnsiteFull Time
15+ YOEBachelor’s degree in engineering, materials science, physics, or related field; 15+ years in semiconductor or photonics packaging; technical organization leadership; advanced packaging or optical integration expertise; OSAT partner experience.
1w
Save
Mark Applied
Hide
Shift Process Engineer, Advanced Packaging Technology Development (APTD)
Boise, Idaho, United States
OnsiteFull Time
Bachelor’s degree in engineering or a related technical field, data analysis and process improvement experience, SPC knowledge, technical communication skills, and experience with AI-enabled tools.
FMEA, 8D, SPC, FDC, Copilot, Claude, Gemini, APC, RMS, Microsoft Office
1w
Save
Mark Applied
Hide
Shift Process Engineer, Advanced Packaging Technology Development (APTD)
Boise, Idaho, United States
OnsiteFull Time
Bachelor's degree in engineering or a related technical field; data analysis and process improvement experience; SPC knowledge; effective technical communication; experience with AI-enabled tools.
Failure Mode and Effects Analysis (FMEA), 8D, Statistical Process Control (SPC), Fault Detection and Classification (FDC), Advanced Process Control (APC), Reliability and Maintainability Systems (RMS), Copilot, Claude, Gemini, Microsoft Office
3w
Save
Mark Applied
Hide
Shift Process Engineer, Advanced Packaging Technology Development (APTD)
Boise, Idaho, United States
OnsiteFull Time
Bachelor's degree in a technical field, data analysis and process improvement experience, SPC knowledge, strong technical communication, and experience with AI-enabled tools; semiconductor experience preferred.
FMEA, 8D, SPC, FDC, Microsoft Copilot, Claude, Gemini, APC, RMS, Microsoft Office
3w
Save
Mark Applied
Hide
Shift Process Engineer, Advanced Packaging Technology Development (APTD)
Boise, Idaho, United States
OnsiteFull Time
Bachelor's degree in a technical field; data analysis and process improvement experience; SPC knowledge; technical communication; AI-enabled tool experience. Semiconductor manufacturing knowledge preferred.
FMEA, 8D, SPC, FDC, APC, RMS, Copilot, Claude, Gemini, Microsoft Office
1w
Save
Mark Applied
Hide
Director PostFab Engineering
Essex Junction or Malta
$167k-$290k/yr OnsiteFull Time
15+ YOERequires a BS, MS, or PhD in a related field and 15+ years in semiconductor or advanced packaging. Experience leading multidisciplinary teams, OSAT partnerships, packaging technologies, supply chains, and customer programs.
1w
Save
Mark Applied
Hide
Director PostFab Engineering
Essex Junction or Malta
$167k-$290k/yr OnsiteFull Time
15+ YOEBS, MS, or PhD in a relevant technical field and 15+ years in semiconductor or advanced packaging. Requires technology organization leadership, packaging expertise, OSAT and supply chain experience, and customer partnership skills.
3w
Save
Mark Applied
Hide
Director, Package Development (29069)
Tempe, Arizona, United States
HybridFull Time
10+ YOEBachelor's degree in engineering and 10+ years in semiconductor packaging or wafer process technology. Requires advanced packaging leadership, customer engagement, global team leadership, and strong technical communication.
HDFO
6d
Save
Mark Applied
Hide
Memory/Advanced Packaging Strategy Technologist
Gloucester, Massachusetts, United States
$148k-$204k/yr OnsiteFull Time
5+ YOERequires 5+ years in semiconductor processing as a lead process integration or device engineer, an M.S. or Ph.D. in a relevant field, and expertise in memory technologies, process integration, device physics, analysis, and presentations.
6d
Save
Mark Applied
Hide
Memory/Advanced Packaging Strategy Technologist
Gloucester, Massachusetts, United States
$148k-$204k/yr OnsiteFull Time
5+ YOERequires 5+ years in semiconductor processing as a lead process integration or device engineer, an M.S. or Ph.D. in a relevant field, and expertise in memory technologies, process integration, device physics, presentation, analysis, and communication.