AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
7+ YOEBS in mechanical engineering,7+ years mechanical and thermal design experience for electronics packaging/SoC,SoC thermal modeling, CFD/FEA, production fleet support, and cross-functional leadership.
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
5+ YOEBachelor's degree or equivalent experience, 5+ years in memory or storage engineering/applications, leadership experience, system architecture and datacenter integration expertise, strong communication and customer engagement, experience using Artificial Intelligence tools.