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Ocotillo Technology Fabrication Thin Films Module Engineer
Phoenix, Arizona, United States
$104k-$199k/yr OnsiteFull Time
2+ YOEBachelor\u0002s (or higher) in engineering/STEM with 2+ years semiconductor manufacturing experience, process characterization, statistical problem-solving, equipment matching, and clean-room experience.
CVD, PVD, ALD, PECVD, LPCVD, HDP, Epitaxy
2w
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Principal Device Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
7+ YOEM.S. or Ph.D. plus 7+ years in power semiconductor device engineering; expertise in device physics, TCAD, reliability, manufacturing, materials, layout; experience with MOSFET design and characterization.
TCAD, CAE
2d
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Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
3w
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Brownfields Junior-Level Environmental Scientist (Field Oversight – West)
Phoenix or California or Arizona or Nevada or United States
$21-$25/hr RemoteFull Time
1+ YOEBS in environmental science/chemistry/engineering,1+ years experience with contaminated site characterization/remediation,knowledge of federal/state environmental laws,proficiency in Windows,periodic travel required.
Windows
3w
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
3w
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
1mo
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Applications Engineering, Senior/Principal - RF Power Amplifier
Mesa, Arizona, United States
OnsiteFull Time
10+ YOEMaster's in electrical engineering, 10+ years RF power amplifier design experience, expertise in GaN-on-SiC PA design, Doherty amplifiers, DPD, AWR/ADS simulators, test characterization, documentation, and mentoring.
AWR, ADS, Digital Predistortion (DPD)
3w
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Brownfields Mid-Level Environmental Scientist (Field Oversight – West)
Phoenix or Seattle or Dallas or Chicago or Idaho or Texas or Illinois
$56k-$80k/yr RemoteFull Time
4+ YOEBS in engineering/geology/environmental science, 4+ years contaminated-site characterization/remediation experience, Phase I/II ESA experience, knowledge of federal/state cleanup laws, Microsoft Excel proficiency.
Microsoft Excel
1w
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Solar Fab Senior Process Engineer
Mesa or Tempe
$85k-$120k/yr OnsiteFull Time
5+ YOEBachelor's degree with 5+ years relevant experience or equivalent; skilled in microelectronic/solar processing, thin-film deposition, patterning, etch, thermal processing, SPC/DOE, vacuum and electro-mechanical systems, and analytical characterization.
RTA, PECVD, ALD, MOCVD, SEM, profilometer, ellipsometer, four-point probe, I-V testers, PL, EL, QE, LIT, SPC, Design of Experiments (DOE)
1mo
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
1mo
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Memory Circuit Design Engineer
Hillsboro or Santa Clara or Austin or Phoenix
$122k-$232k/yr HybridFull Time
4+ YOEMaster's in EE/CE + 4+ years' experience or PhD; experience designing/characterizing memory circuits (SRAM/ROM/Register Files), PPA optimization, custom digital design, simulation, layout, verification, and knowledge of EDA tools.
EDA tools
1mo
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Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation