6 characterization jobs at 2 companies in Eloy, AZ
5d
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Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
3w
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
3w
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
4w
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ATD Experienced Laser Development Engineer
Phoenix or Chandler
$115k-$220k/yr OnsiteFull Time
3+ YOEDegree in Physics/Mechanical/Optical Engineering or related STEM with relevant industry experience; proficiency in SPC/DOE, process characterization, data analysis; familiarity with semiconductor packaging and laser-based equipment.
Statistical Process Control (SPC), Design of Experiments (DOE), Python, Numpy, Pandas, SQL, JMP, Minitab
2mo
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Applications Engineering, Senior/Principal - RF Power Amplifier
Mesa, Arizona, United States
OnsiteFull Time
10+ YOEMaster's in electrical engineering, 10+ years RF power amplifier design experience, expertise in GaN-on-SiC PA design, Doherty amplifiers, DPD, AWR/ADS simulators, test characterization, documentation, and mentoring.
AWR, ADS, Digital Predistortion (DPD)
1mo
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Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation