19 characterization jobs at 7 companies in Litchfield Park, AZ

2d
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Senior DDR Analog Characterization Engineer
Chandler, Arizona, United States
$198k-$268k/yr HybridFull Time
Arm
ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
Bachelor's or master's degree in electrical or computer engineering, 3.0+ GPA, DDR/LPDDR validation experience, signal integrity and timing expertise, laboratory equipment experience, and strong communication skills.
DDR5, LPDDR6, Python
1d
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Senior PCIe Analog Characterization Engineer
Chandler, Arizona, United States
$198k-$268k/yr HybridFull Time
Arm
ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
5+ YOERequires 5+ years validating high-speed serial interfaces, PCIe Gen5 compliance testing expertise, high-speed measurement skills, PCIe architecture knowledge, lab equipment proficiency, and validation or test automation experience.
PCIe, high-speed oscilloscopes, BERTs, protocol analyzers, network analyzers, Python
3d
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Packaging Module Development Engineer
Phoenix, Arizona, United States
$134k-$189k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0.5+ YOEPhD in engineering, physics, chemistry, or related STEM field; 6+ months' experience with SPC, DOE, and process development or characterization in packaging or manufacturing.
Statistical Process Control (SPC), Design of Experiments (DOE)
2d
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Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer
Phoenix, Arizona, United States
$76k-$126k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's degree in engineering or physics, US citizenship, security clearance eligibility, and basic knowledge of semiconductor manufacturing, device physics, materials characterization, or microscopy.
AutoTEM, TEM, FIB, PFIB, SEM
2mo
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
ASM International
ASM InternationalEuronext Amsterdam: ASM: Provides wafer processing equipment for semiconductor device manufacturing.
0+ YOEMaster's or PhD in chemical engineering, materials science, electrical engineering, or physics; experience with thin-film deposition, materials characterization, experimental design, and semiconductor processes.
Atomic Layer Deposition, ALD, PEALD, PECVD, CVD, CFD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, HRTEM, FESEM, Auger, Raman, ellipsometry, CMOS, Design of Experiments (DOE), Response Surface Methodology (RSM), Ishikawa diagrams
6d
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Intel Process Integration Engineer - (FE)
Hillsboro or Phoenix
$104k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0.5+ YOEPhD in a listed engineering, physics, optics, materials science, or related field plus 6+ months in semiconductor fabrication, device characterization, or cleanroom process development.
JMP, MATLAB, Python, JSL, TCL, SQL, C, C++, SPC, DOE, FMEA, Cpk, Ppk, Control charts, Capability analysis, SOPs, ALD, PE CVD
3d
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Senior Engineer, Process Engineering [Epitaxy] | Global R&D Process Engineering Program
Leuven or Helsinki or Tokyo or Phoenix or Dongtan
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
PhD in physics, chemistry, chemical engineering, or materials science; epitaxy and characterization experience; semiconductor physics and processing knowledge; and project planning, execution, and communication skills.
RPCVD, MOCVD, MBE, AFM, XRD, TEM, SIMS, ellipsometry
3d
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Senior Engineer, Process Engineering [Epitaxy] | Global R&D Process Engineering Program
Leuven or Helsinki or Tokyo or Phoenix or Dongtan or United States or Belgium or Finland or Japan or Korea
FieldFull Time
ASM International
ASM InternationalEuronext Amsterdam: ASM: Provides wafer processing equipment for semiconductor device manufacturing.
PhD in physics, chemistry, chemical engineering, or materials science; experience with epitaxy techniques and characterization methods; semiconductor physics, equipment, project planning, and communication skills.
RPCVD, MOCVD, MBE, AFM, XRD, TEM, SIMS, ellipsometry, ALD
2w
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Ocotillo Technology Fabrication Thin Films Module Engineer
Phoenix, Arizona, United States
$104k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEBachelor\u0002s (or higher) in engineering/STEM with 2+ years semiconductor manufacturing experience, process characterization, statistical problem-solving, equipment matching, and clean-room experience.
CVD, PVD, ALD, PECVD, LPCVD, HDP, Epitaxy
1mo
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Principal Device Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
7+ YOEM.S. or Ph.D. plus 7+ years in power semiconductor device engineering; expertise in device physics, TCAD, reliability, manufacturing, materials, layout; experience with MOSFET design and characterization.
TCAD, CAE
2w
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Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
1mo
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
1mo
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
1mo
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Brownfields Mid-Level Environmental Scientist (Field Oversight – West)
Phoenix or Seattle or Dallas or Chicago or Idaho or Texas or Illinois
$56k-$80k/yr RemoteFull Time
Toeroek Associates
Toeroek Associates: Provides environmental and technical consulting services to government entities.
4+ YOEBS in engineering/geology/environmental science, 4+ years contaminated-site characterization/remediation experience, Phase I/II ESA experience, knowledge of federal/state cleanup laws, Microsoft Excel proficiency.
Microsoft Excel
4d
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Manager, Materials Science (Ph.D.)
Phoenix, Arizona, United States
OnsiteFull Time
Exponent
ExponentNASDAQ: EXPO: Provides multidisciplinary scientific and engineering consulting for complex problems.
5+ YOEPh.D. in materials science or related field, 5+ years post-graduate experience, battery R&D and consulting experience, materials characterization expertise, team management, business development, and strong communication skills.
CT, SEM, EDS, FTIR, EIS, cyclic voltammetry
2mo
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
1mo
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Memory Circuit Design Engineer
Hillsboro or Santa Clara or Austin or Phoenix
$122k-$232k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
4+ YOEMaster's in EE/CE + 4+ years' experience or PhD; experience designing/characterizing memory circuits (SRAM/ROM/Register Files), PPA optimization, custom digital design, simulation, layout, verification, and knowledge of EDA tools.
EDA tools
1mo
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Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation
1mo
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Integrated Photonics Engineer
Tempe or Phoenix or San Francisco
$125k-$185k/yr HybridFull Time
Azora
Azora: Building modular optical ground stations for laser space communications.
3+ YOEMS/PhD or equivalent,3+ years PIC design and characterization,proficiency with photonic simulation/layout tools,foundry PDK/tape-out experience,strong lab skills and fiber alignment,eligibility under U.S. export control rules.
Lumerical, Synopsys, KLayout, IPKISS, PDK, OSA, LCA, tunable lasers, FPGA