11 characterization jobs at 5 companies in Tolleson, AZ

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Ocotillo Technology Fabrication Thin Films Module Engineer
Phoenix, Arizona, United States
$104k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEBachelor\u0002s (or higher) in engineering/STEM with 2+ years semiconductor manufacturing experience, process characterization, statistical problem-solving, equipment matching, and clean-room experience.
CVD, PVD, ALD, PECVD, LPCVD, HDP, Epitaxy
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Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
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Principal Device Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
7+ YOEM.S. or Ph.D. plus 7+ years in power semiconductor device engineering; expertise in device physics, TCAD, reliability, manufacturing, materials, layout; experience with MOSFET design and characterization.
TCAD, CAE
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
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ATD Experienced Laser Development Engineer
Phoenix or Chandler
$115k-$220k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEDegree in Physics/Mechanical/Optical Engineering or related STEM with relevant industry experience; proficiency in SPC/DOE, process characterization, data analysis; familiarity with semiconductor packaging and laser-based equipment.
Statistical Process Control (SPC), Design of Experiments (DOE), Python, Numpy, Pandas, SQL, JMP, Minitab
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Brownfields Mid-Level Environmental Scientist (Field Oversight – West)
Phoenix or Seattle or Dallas or Chicago or Idaho or Texas or Illinois
$56k-$80k/yr RemoteFull Time
Toeroek Associates
Toeroek Associates: Provides environmental and technical consulting services to government entities.
4+ YOEBS in engineering/geology/environmental science, 4+ years contaminated-site characterization/remediation experience, Phase I/II ESA experience, knowledge of federal/state cleanup laws, Microsoft Excel proficiency.
Microsoft Excel
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
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Memory Circuit Design Engineer
Hillsboro or Santa Clara or Austin or Phoenix
$122k-$232k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
4+ YOEMaster's in EE/CE + 4+ years' experience or PhD; experience designing/characterizing memory circuits (SRAM/ROM/Register Files), PPA optimization, custom digital design, simulation, layout, verification, and knowledge of EDA tools.
EDA tools
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Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation
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Integrated Photonics Engineer
Tempe or Phoenix or San Francisco
$125k-$185k/yr HybridFull Time
Azora
Azora: Building modular optical ground stations for laser space communications.
3+ YOEMS/PhD or equivalent,3+ years PIC design and characterization,proficiency with photonic simulation/layout tools,foundry PDK/tape-out experience,strong lab skills and fiber alignment,eligibility under U.S. export control rules.
Lumerical, Synopsys, KLayout, IPKISS, PDK, OSA, LCA, tunable lasers, FPGA