HPNYSE: HPQ: Manufactures personal computers, printers, and 3D printing hardware.
10+ YOE10+ years engineering experience; electrical design focus; compute architecture knowledge; bachelor’s or master’s in computer/electrical engineering; willing to work US/global time zones.
HPNYSE: HPQ: Manufacturer of personal computers, printers, and imaging devices.
10+ YOE10+ years engineering experience with electrical/compute architecture (PCBA, power, HSIO, memory); bachelor's or master’s in computer/electrical engineering; strong strategic, communication, and project management skills.
Hewlett Packard EnterpriseNYSE: HPE: Providing global edge-to-cloud infrastructure and IT solutions for businesses.
12+ YOEBachelor’s or Master’s in computer science or information systems; 12+ years embedded software experience; strong C/C++, Python, Go; Linux development; RESTful APIs; firmware security features (HWRot, IDEVID, Platform Certificates); SDLC mastery.
C, C++, Python, Go, Linux, RESTful API, Firmware Security Features
Principal Architect for Manageability Firmware Stack
Spring or Fort Collins or Frisco or Chippewa Falls
$152k-$349k/yrOnsiteFull Time
Hewlett Packard EnterpriseNYSE: HPE: Providing global edge-to-cloud infrastructure and IT solutions for businesses.
10+ YOEBachelor's or Master's in Computer Science/Information Systems, 10+ years' experience, expertise in firmware/manageability architecture, Redfish, Open BMC, Yocto, secure SW lifecycle, TDD, AI integration, and strong communication skills.
Santa Clara or Fort Collins or Folsom or Austin or Phoenix or San Jose
$164k-$269k/yrHybridFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
7+ YOEBachelor's in EE/CE/STEM, 7+ years in SoC/CPU/memory subsystem architecture (CPU/cache/coherency, DDR/HBM, controllers, QoS), system-level performance and PPA tradeoffs, experience driving architecture to silicon; ARM/x86 and IPU/SmartNIC experience preferred.