7 data integration developer jobs at 2 companies in Burlington, VT
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Packaging Integration Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
New college graduate in STEM with ≥3.0 GPA; coursework or experience in semiconductor packaging, silicon photonics, materials, reliability, data analysis, and cross-functional teamwork.
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Packaging Integration Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
Degree in a STEM discipline (BSc/MSc/PhD) with ≥3.0 GPA, basic semiconductor packaging or silicon photonics knowledge, analytical and problem-solving skills, experience analyzing experimental data, and ability to work cross-functionally.
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Quantum Topological Qubit Integration
Malta or Essex Junction
$85k-$146k/yr OnsiteFull Time
5+ YOEBS/MS in EE, Physics, or Materials Science; 5+ years semiconductor process/integration engineering; experience with device physics, advanced materials (III-V, superconductors), DOE and data analysis; strong problem solving and communication.
Design of Experiments (DOE), MBE, MOCVD, BEOL
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Packaging Design Integration Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
Graduating with a bachelor's, master's, or PhD in an applicable STEM discipline, 3.0 GPA, analytical skills, engineering data analysis, cross-functional teamwork, and English fluency.
Photonix, HFSS, Zemax/Zmax, FloTHERM, Design of Experiments (DOE)
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Packaging Design Integration Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
Graduating with a bachelor's, master's, or PhD in a STEM discipline, 3.0 GPA, analytical skills, engineering data experience, teamwork, and English fluency; packaging knowledge preferred.
Photonix, HFSS, Zemax/Zmax, FloTHERM, Design of Experiments (DOE)
2mo
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Quantum Topological Qubit Integration
Malta or Essex Junction
$85k-$146k/yr OnsiteFull Time
5+ YOEBS/MS in EE, Physics, Materials Science or related; 5+ years semiconductor process/integration engineering; experience with device physics, III-V and superconducting materials; DOE and characterization data analysis; strong analytical and communication skills.
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MuleSoft Architect
Charleston or Las Vegas or Orlando or Annapolis or Portland or Boston or Huntsville or Dayton or Atlanta or Colorado Springs or Jericho or Dover or Albuquerque or Frankfort or Denver or New York City or Groton or Salt Lake City or Fort Leavenworth or Jersey City or Omaha or Bismarck or Sacramento or New Orleans or Indianapolis or Helena or Des Moines or Jackson or Hanover or Austin or Boise or Chattanooga or Tucson or Fayetteville or Chicago or St. Louis or Lansing or Pittsburgh or Philadelphia or Augusta or Oklahoma City or Brooklyn Park or Pringle or McLean or Newport or Cheyenne or Martinsburg or Cleveland or Little Rock or Madison or Albany or Seattle or Washington
$99k-$225k/yr OnsiteFull Time
7+ YOE7+ years in data integration or API development, MuleSoft and Salesforce integration experience, familiarity with API-led architecture and integration governance, experience using AI tools for MuleSoft, ability to obtain Public Trust; HS diploma/GED required; Bachelor's preferred.
MuleSoft, Salesforce, Pega, Appian