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38 data integration engineer jobs at 4 companies in Eagle, ID

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Process Integration Engineer | APTD
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
3+ YOE3+ years semiconductor process integration experience; MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field; experience in process integration, advanced packaging, or related semiconductor tech in an R&D environment.
DoE, data analysis, wirebond, microbump, hybrid bonding, 2.5D/3DIC packaging
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Process Integration Engineer, NPI
Boise, Idaho, United States
OnsiteFull Time
Photronics
PhotronicsNASDAQ: PLAB: Manufactures high-precision photomasks for semiconductors and flat-panel displays.
5+ YOELead end-to-end process integration for new photomask products; strong lithography and data analysis skills; 5-7 years in semiconductor manufacturing; on-site in Boise, ID.
lithography, photolithography, data analysis, SPC, automation, scripting
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DRAM Process Integration Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
5+ YOEMS or PhD in engineering plus 5+ years semiconductor experience; expertise in DRAM/NAND, process integration, device physics, materials science, experiment design, data analysis, and project leadership.
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Tainan or Bundang or Santa Clara or Heimstetten or Boise or Rehovot
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive experience in semiconductor process integration and advanced packaging, project management, technical leadership, data analysis, and communication skills.
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Head of Prism Operations
Boise or Edinburgh or India
HybridFull Time
Clearwater Analytics
Clearwater AnalyticsNYSE: CWAN: Automated investment accounting and reporting software for institutional investors.
8+ YOE3+ MgmtLead a distributed team delivering Prism product; strong data engineering, SQL, client reporting, and leadership experience.
SQL, Data pipeline, Data integration, Reporting platforms
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