11 devsecops software engineer jobs at 1 company in Huntsville, TX
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Principal Embedded Firmware and Software Engineer
Spring, Texas, United States
$147k-$231k/yrOnsiteFull Time
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
10+ YOE10+ years in embedded firmware, software, systems, or platform engineering; advanced embedded C and Python skills; experience with BIOS/UEFI, RTOS, security, Git, Linux, debugging, and software architecture.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
10+ YOE10+ years in embedded firmware, software, systems software, platform engineering, or related fields; advanced embedded C, Python, BIOS/UEFI, RTOS, security, debugging, Git, Linux, and Agile expertise.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
10+ YOE10+ years in embedded firmware, software, systems, or platform engineering; strong embedded C and Python skills; experience with BIOS/UEFI, RTOS, security, debugging, Git, Linux, and Agile.
Spring or Austin or Houston or Hyderabad or Bengaluru or Pune or Vancouver or Mexico or Brazil or China or Colombia or Europe
$200k-$320k/yrOnsiteFull Time
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
Executive software engineering leader to own strategy, modernization, SDLC, DevSecOps, supplier strategy, budgets, and global delivery for Lead-to-Order platforms.
Software and Engineering Graduate Roles - HP Solutions (HPS)
Fort Collins or Spring or Austin
$73k-$109k/yrOnsiteFull Time
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
0+ YOEUniversity degree completed or in progress; degree completed before start; no more than 24 months related experience and 12 months since graduation; U.S. work authorization without future sponsorship.
Software and Engineering Graduate Roles - HP Solutions (HPS)
Fort Collins or Spring or Austin
$73k-$109k/yrOnsiteFull Time
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
0+ YOEUniversity degree completed or in progress, completed before start; no more than 24 months related professional experience and 12 months since graduation; U.S. work authorization without current or future sponsorship.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
12+ YOE12+ years engineering experience, degree in engineering or CS or equivalent, experience defining technology roadmaps, cross‑functional leadership, mentoring, and delivering complex software/platform solutions.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
5+ YOERequires 5+ years in solution engineering and software, AI/ML and data science expertise, Python or C++, presales experience, hybrid-cloud DevOps, and a BS/MS or equivalent experience.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
12+ YOETypically 12+ years experience, four-year or graduate degree or equivalent experience, expertise in engineering product design, roadmap development, and cross-functional collaboration.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
5+ YOERequires 5+ years in solution engineering and software, AI/ML and data science expertise, Python or C++, hybrid cloud and DevOps experience, presales success, and a BS/MS or equivalent experience.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
5+ YOE5+ years in solution engineering and software; AI, machine learning, data science, AI frameworks, Python or C++, DevOps, hybrid cloud, presales, and enterprise data science experience; BS/MS or equivalent.