8 euv lithography process development engineer jobs at 1 company in United States

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EUV Lithography Process Development Engineer- TPG
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
3+ YOEMS/PhD with 3+ years or BS with 10+ years semiconductor experience; strong EUV/DUV lithography knowledge; experience with 193nm immersion, photolithography optics, DOEs; strong communication and analysis skills.
Prolith, S-Litho, JMP, Python
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EUV Lithography Process Development Engineer- TPG
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
3+ YOEMS/PhD with 3+ years semiconductor experience or BS with 10+ years; strong EUV and 193nm immersion knowledge; experience with Prolith or S-Litho; statistical analysis and experiment design; strong communication skills.
Prolith, S-Litho, JMP, Python
2mo
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EUV Mask Technology R&D Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
2+ YOEMS or PhD in Materials Science/Physics/Chemistry/Chemical Engineering; 2+ years semiconductor manufacturing or process development experience; experience with EUV/lithography, mask materials/processes, DOE and OPC preferred.
OPC, DOE
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EUV Mask Technology R&D Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
2+ YOEMS or PhD in materials science/physics/chemistry/chemical engineering, 2+ years semiconductor manufacturing or process development experience; experience in EUV/photomask materials, lithography fundamentals, DOE, and cross-functional collaboration.
DOE, OPC
2mo
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Principal Engineer Photolithography DRAM Process Development (Evergreen)
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
7+ YOEBS in engineering/physics + 7+ years (or MS/PhD + 6+ years) semiconductor experience; deep knowledge of imaging, overlay, reticles, OPC, scanners; hands-on lithography process development and characterization; project management skills.
EUV, OPC, GenAI tools
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SMTS Process Engineer, RET OPC
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
12+ YOE12+ years semiconductor experience focused on RET/OPC/lithography or mask development; BS in EE/Materials/Physics/Chemical Engineering; hands-on RET/OPC and EUV lithography experience; strong collaboration and communication skills.
Sentaurus Litho, ProLith, Synopsys, Siemens, Cadence, Brion, Python, Perl, TCL, C, C++
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EUV Mask BEOL R&D Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
2+ YOEMS or PhD in a related field, 2+ years in semiconductor manufacturing or process development, experience with mask/lithography preferred, strong modeling and collaboration skills.
OPC
2mo
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Principal Engineer Photolithography DRAM Process Development (Evergreen)
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
6+ YOEBachelor's in engineering/physics +7 yrs semiconductor (or MS/PhD +6 yrs); deep lithography knowledge (imaging, overlay, reticles, OPC, scanners); hands-on lithography process development; independent project management and analytical skills.
EUV, OPC, DOE, GenAI