ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
10+ YOEBachelor's in EE/CE or related,10+ years SoC/IP/EDA or customer-facing technical experience, system-level CPU/GPU/NPU knowledge, strong customer-facing and presentation skills.
EDA tools, Arm Compute Subsystems (CSS), CoreLink NoC/Mesh, CoreSight Debug/Trace, Mali GPU, Ethos NPU, CPU
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
8+ YOE2+ MgmtBachelor's in Electrical Engineering,8+ years in power electronics/digital multiphase power,2+ years people leadership,lab debug experience,ability to manage datacenter customer programs and mentor FAEs.
oscilloscopes, current probes, electronic loads, load transient tools, PMBus, telemetry systems
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
5+ YOEBachelor's/Master's in EE/CE, 5+ years FAE or development engineering experience in semiconductors; experience with C/C++, embedded Linux, SoC interfaces (Ethernet, PCIe, MIPI, LP DDR5, USB2.0/3.0), ARM Cortex, RTOS; travel up to 30%.
C, C++, embedded Linux, u-boot, RTOS, Tensorflow Lite, ONNX, Ethernet, PCIe, MIPI, LP DDR5, USB2.0/3.0, ARM Cortex A, ARM Cortex M
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
6+ YOEBachelor's degree in Electrical Engineering and 6+ years in analog and power electronics design, applications, or customer-facing engineering. Requires customer leadership, debugging, collaboration, presentations, and 10–20% travel.
PMICs, DC/DC converters, LDOs, oscilloscopes, power analyzers, thermal-analysis tools, MCUs, MPUs, DDR, AI platforms, PCB
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
10+ YOEBachelor’s or Master’s degree in engineering or computer science, 10+ years in FPGA, digital logic, embedded systems, or applications engineering, and expertise in RTL, timing, synthesis, FPGA flows, and high-speed interfaces.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
5+ YOEBachelor's degree in a technical field or equivalent, approximately 5 years of relevant experience, systems or hardware enablement expertise, server architecture knowledge, Linux proficiency, and customer-facing communication skills.
Foxconn AssemblyTaiwan Stock Exchange: 2317: Assembles electronics and computer hardware for global technology brands.
3+ YOEBachelor's in electrical/computer engineering or computer science, ~3 years system-level test experience in manufacturing, strong analytical and communication skills, able to lift 50 lbs, familiarity with Linux/Unix/Python preferred.
TylSemi: Building chiplet-native infrastructure for high-performance AI systems.
10+ YOE10+ years in BD/FAE/customer or product management in semiconductors with relationships across hyperscaler silicon teams; technical depth to engage on chiplet integration and standards; US-based with ability to travel.
TSMCNew York Stock Exchange: TSM: Manufactures advanced semiconductor integrated circuits for global technology companies.
15+ YOE15+ years semiconductor experience, bachelor’s or master’s in EE/Computer Engineering, customer-facing FAE/FTS experience, PMIC/AMS expertise, strong program management and technical communication skills.
SupermicroNASDAQ: SMCI: Designs and manufactures high-performance server and storage solutions.
1+ YOEBS in Engineering, 1+ years in FAE/validation/NPI/test or fixture design, hands-on connector/cabling experience, system/component debugging, documentation skills, and ability to travel domestically and internationally.
SemtechNASDAQ: SMTC: Produces high-performance analog and mixed-signal semiconductor products
3+ YOEBachelor's in Electrical Engineering, 3+ years FAE/applications engineering experience in semiconductor or related OEM/ODM/distributor, experience with design-in cycles, familiarity with ESD protection and sensing products, strong customer-facing communication skills.
TylSemi: Building chiplet-native infrastructure for high-performance AI systems.
10+ YOE10+ years in BD/FAE/CPM in semiconductors with established hyperscaler and AI chip relationships, technical depth to engage R&D, track record of closing long-cycle semiconductor deals, US-based and able to travel.