7 interconnection engineer jobs at 5 companies in Reidsville, NC
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Director, Interconnection Execution
Durham or Asheville or Chicago or New York City or Washington or San Francisco
$200k-$240k/yrHybridFull Time
Cypress Creek Renewables: Develops and operates solar and energy storage projects.
6+ YOEBachelor's degree in engineering/business/energy systems, 6+ years in grid interconnection or utility project management, experience managing GIA compliance, strong knowledge of FERC LGIP/LGIA and ISO/RTO processes, negotiation and stakeholder management skills.
8 Rivers: Develops and commercializes infrastructure-scale clean energy and decarbonization technologies.
8+ YOE8+ years utility-scale power project development or systems engineering experience; BS in engineering; deep power-cycle, turbine, interconnection, and permitting knowledge; consultant oversight and technical scoping experience.
Google Earth, Open Infrastructure Map, PSS/E, Thermoflow (GT PRO/GT MASTER)
2+ YOEBachelor's degree or equivalent, 2+ years with C++, Python, Go, or similar, and 2+ years in network architectures, protocols, design, implementation, and troubleshooting.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
6+ YOEMaster's (or equivalent) in EE/CS/CE, 6+ years in GPU/CPU architecture focused on memory caching and interconnects, B.S./PhD optional, strong communication and mentoring experience, familiarity with performance simulation, RTL, and silicon debug.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
3+ YOEM.S. or Ph.D. in CS/CE/EE (or equivalent),3+ years SoC or memory system architecture experience, expertise in caches, coherence, DDR, interconnects,performance modeling, C/C++, Python/Perl; BSV/Verilog/SV/UVM a plus.
Business Development Manager- Emerging Growth Marketing
Durham or San Francisco or Phoenix
OnsiteFull Time
WolfspeedNYSE: WOLF: Manufactures silicon carbide and GaN semiconductors for power systems.
10+ YOEBachelor's in engineering or materials,10+ years in semiconductor packaging business development, deep packaging and interconnect knowledge, executive relationship and negotiation skills, willingness to travel globally.