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Civil Engineer II - Materials & Research (Berlin, VT, US)
Berlin, Vermont, United States
OnsiteFull Time
2+ YOEBachelor's in civil engineering or related field with 2 years engineering experience OR associate degree with 4 years experience and Engineer Intern licensure; ability to develop and review materials specifications and coordinate with stakeholders.
4d
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Sr. Process Engineer - Photolithography
Essex Junction, Vermont, United States
$69k-$120k/yr OnsiteFull Time
2+ YOEBachelor's in engineering or materials plus 2+ years semiconductor experience, applied photolithography knowledge, project leadership, Lean familiarity, and strong written/verbal English.
4d
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Sr. Process Engineer - Photolithography
Essex Junction, Vermont, United States
$69k-$120k/yr OnsiteFull Time
2+ YOEBachelor's in engineering or materials +2 years semiconductor experience, applied photolithography knowledge, project leadership, Lean manufacturing familiarity, SPC, cleanroom experience, and English fluency.
2w
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Materials and Processes Composites Engineer
South Burlington, Vermont, United States
$100k-$140k/yr OnsiteFull Time
5+ YOEBachelor's in engineering, 5+ years aerospace composites experience, supplier auditing, spec and test-plan writing, material/process qualification, manufacturing troubleshooting, and strong communication.
1mo
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Manufacturing Process Engineer II
Santa Clara or Lebanon
$110k-$130k/yr OnsiteFull Time
5+ YOEBachelor's in engineering/materials/chemistry/physics with ~5+ years MEMS/semiconductor wafer fab experience; strong root-cause analysis, SPC/DoE, problem solving, metrology, and presentation skills.
Statistical Process Control (SPC), Design of Experiments (DoE), PECVD, CMP, AOI, FDC, Photolithography, Wet Etch, Thin Films, Sputtering, Laser Dice, Automation Systems, wafer metrology tools
1mo
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Manufacturing Process Engineer II
Santa Clara or Lebanon
$110k-$130k/yr OnsiteFull Time
5+ YOEBachelor's in Engineering/Materials/Chemistry/Physics plus ~5 years MEMS/semiconductor wafer fab experience (or advanced degree with reduced experience). Requires SPC/DoE familiarity, wafer metrology, problem solving, and cleanroom experience.
Photolithography, Wet Etch, Thin Films, Sputtering, PECVD, Laser Dice, Ash and Wet Strip, Bond, CMP, Dry Film, AOI, Automation Systems, FDC, wafer metrology tools, Statistical Process Control (SPC), Design of Experiments (DoE)
1mo
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Manufacturing Process Engineer III
Santa Clara or Lebanon or Tokyo
$135k-$165k/yr OnsiteFull Time
8+ YOEBachelor's in Engineering/Material Science/Chemistry/Physics with typically 8+ years' MEMS/semiconductor process experience (alternatives with M.S./PhD plus less experience). Experience with wafer fab processes, SPC/DoE, JMP/Minitab, root-cause analysis, and yield improvement.
JMP, Minitab, SPC, DoE, PECVD, CMP, AOI, FDC, Automation Systems, Photolithography, Wet Etch, Thin Films, Sputtering, Laser Dice, Ash, Wet Strip, Bond, Dry Film
1mo
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Quality Assurance Engineer, Welding Professional
Colchester, Vermont, United States
$90k-$110k/yr OnsiteFull Time
3+ YOEUS citizen required. Bachelor’s in Welding/Engineering/Metallurgy/Materials Science (or Associate + experience). Minimum 3 years welding engineering/quality control experience; ASNT Level 2 NDE desirable. Experience with ASME codes, 10CFR50 App B, 10CFR21, NQA‑1. Able to lift 50 lbs; travel 10–30%.
Six Sigma, FMEA, Lean manufacturing
1mo
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Distinguished and faculty development chairs in Materials Science
Hanover, New Hampshire, United States
OnsiteFull Time
Doctorate in materials science, engineering, or related field; potential to lead externally-funded research; strong research and teaching record in areas such as computational modeling, advanced manufacturing, energy/quantum materials, or ML/AI applications.
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