5+ YOEBachelor's degree in engineering or materials science, 5+ years in semiconductor processing and wafer polishing, process optimization, statistical process control, FMEA, data analysis, and Microsoft Office Suite proficiency.
Microsoft Office Suite, CMP (Chemical Mechanical Planarization), FMEA
American Packaging Corporation: Manufactures flexible packaging solutions for consumer and industrial products.
Bachelor's in a technical field (or equivalent) with experience in product development, project management, printing/laminations desired, material/process research, customer interface, and ability to support manufacturing and quality.