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Senior Engineer, Process Engineering | Global R&D Process Engineering Program
Leuven or Helsinki or Tokyo or Phoenix or Dongtan
OnsiteFull Time
0+ YOEPhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics; 0-7+ years in deposition and materials characterization; knowledge of ALD/CVD/epitaxy, and CMOS device characterization.
ALD, CVD, PEALD, Epitaxy, PECVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry, DOE, RSM, CFD
1w
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Substrate Packaging Research and Development Engineer
Phoenix or Chandler
$134k-$189k/yr HybridFull Time
2+ YOEPhD in materials or related field, 2+ years experience, expertise in materials characterization, design of experiments, statistical analysis, and packaging process development; optics/laser experience preferred.
2w
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Packaging Module Development Engineer
Phoenix or Chandler
$134k-$189k/yr OnsiteFull Time
4+ YOEBachelor's or MS in engineering/materials/physical science, 4+ years process development and DOE experience, materials characterization (DSC,TGA,D/TMA,ICPMS,FTIR,SEM), EM data analysis, and troubleshooting skills.
DSC, TGA, D/TMA, ICPMS, FTIR, SEM, Microsoft Office
1w
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Principal Device Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
7+ YOEM.S. or Ph.D. plus 7+ years in power semiconductor device engineering; expertise in device physics, TCAD, reliability, manufacturing, materials, layout; experience with MOSFET design and characterization.
TCAD, CAE
1mo
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
1mo
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Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation