2mo
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Principal Materials and Process (M&P) Engineer/Sr Principal Materials and Process (M&P) Engineer
Melbourne, Florida, United States
$89k-$168k/yr OnsiteFull Time
5+ YOEDegree in STEM with 5+ years (Principal) or 9+ years (Sr Principal) experience in metallic materials for airframe structures, ability to obtain DoD Secret and SAP clearances, experience with failure analysis, repair processes, and production materials/process development.
3d
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Staff Process Engineer
Palm Bay, Florida, United States
OnsiteFull Time
5+ YOEDevelop and qualify high-reliability semiconductor assembly processes; 5+ years manufacturing experience preferred; bachelor\u0002s degree in engineering or materials; U.S. citizen or permanent resident; strong communication and attention to detail.
CAD, Fusion 360
3mo
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Launch Engineer, Operations
Colorado or California or Texas or Florida or Virginia or Lompoc or Wallops Island or Cape Canaveral or Sweden
FieldFull Time
5+ YOEBachelor's in engineering,5+ years in test/launch or high-consequence operations, on-console experience, automation/procedure development, proficiency with Python or MATLAB, comfortable with field testing and hazardous materials.
Python, MATLAB, Confluence, Jira, SVN, Bitbucket, Git, SCADA
5d
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Associate, Mechanical Engineering (39090)
Palm Bay, Florida, United States
OnsiteFull Time
Pursuing or recently completed a Bachelor's in Mechanical/Aerospace/Materials/related engineering; able to create specs, test plans, execute verification testing, and support product development and factory operations.
3w
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Member of Technical Staff (MTS) of Advanced Packaging & Module Engineering
Kissimmee or Minnesota or Texas
$184k-$277k/yr OnsiteFull Time
12+ YOE5+ MgmtBS/MS/PhD in EE, Materials, Chemical Engineering, Physics or related; 12+ years in semiconductor technology/advanced packaging; 5+ years people-leadership; US citizenship and ability to obtain government security clearance; expertise in SPC, DOE, process development and HVM.
APC, AI-enabled SPC, SPC, DOE, 6-sigma, A3, 8D, DMAIC, KPI, OKR, Litho, Etch, Deposition, CMP, FOWLP, FCBGA, SiP, RDL, 3DIC, HBM, TSV