2mo
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Director – Package Materials Integration, APTD
Boise, Idaho, United States
OnsiteFull Time
15+ YOE10+ MgmtLead global team; oversee advanced packaging materials roadmap; 15+ years in semiconductor packaging; MS/PhD preferred.
2mo
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Process Support Engineer III
Boise, Idaho, United States
$108k-$149k/yr OnsiteFull Time
4+ YOEBachelor's in chemistry/physics/materials/electrical engineering; 4–7 years semiconductor fab or equipment experience; strong English communication.
Design of Experiments, Statistical Analysis, Root Cause Analysis
2mo
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East Idaho - Construction Materials Testing Engineering Technician I
Boise, Idaho, United States
OnsiteFull Time
0.5+ YOEHigh school diploma or equivalent; 6 months experience; valid driver’s license with acceptable history; certifications: Nuclear Density Gauge within 6 months; ACI within 90 days; internal safety certifications.
6d
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Senior Engineer, Field Process (Boise, ID)
Boise, Idaho, United States
FieldFull Time
PhD or MS in materials science/chemical engineering/physics with hands-on thin-film (ALD, PEALD, PECVD, Epitaxy) experience, troubleshooting and DOE skills, ability to travel and support extended hours, strong communication.
ALD, PEALD, PECVD, Epitaxy
1mo
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R&D Engineer III - Advanced Memory
Boise, Idaho, United States
OnsiteFull Time
6+ YOE6+ years experience in semiconductor/photomask manufacturing or process development; BS/MS in Engineering, Physics, Chemistry, Materials Science or related; expertise in lithography, metrology, OPC, process troubleshooting, and cross-functional project leadership.
1mo
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
3mo
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Thermal Spray Development Engineer
Boise, Idaho, United States
OnsiteFull Time
PhD/Master/Bachelor in Materials Science or Engineering; experience with thermal spray, ceramics, suspension plasma spray; DOE; coating characterization; semiconductor equipment background preferred.
thermal spray equipment, ceramics, suspension plasma spray, micrograph analysis, DOE
1mo
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Packaging & Material Handling System Designer
Meridian or Plover or Madison or Minneapolis
$24-$35/hr OnsiteFull Time
3+ YOEHigh school diploma, 3+ years packaging/material handling or industrial facilities design experience, AutoCAD and Inventor experience, ability to work with scan/point cloud data, strong communication, willingness to travel 10–30%.
AutoCAD, Inventor
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