6 materials science engineer jobs at 4 companies in Ojai, CA
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Materials and Process Engineer 3/4
Woodland Hills, California, United States
$104k-$194k/yrOnsiteFull Time
Northrop GrummanNYSE: NOC: Develops and manufactures advanced aerospace, defense, and space systems.
5+ YOEActive US Secret clearance, STEM bachelor's (materials science preferred), 5+ years engineering experience (Principal) or 8+ years (Sr Principal), metallurgy and manufacturing process knowledge, lab/ metallography experience.
Northrop GrummanNYSE: NOC: Develops and manufactures advanced aerospace, defense, and space systems.
2+ YOEBS in STEM (materials science preferred) with 2+ years engineering experience (5+ years for principal), U.S. citizenship, ability to obtain Secret clearance, knowledge of metallurgy, adhesives, testing methods, lab techniques, and manufacturing processes.
Teledyne TechnologiesNYSE: TDY: Manufactures sensors, cameras, and electronics for aerospace and defense.
3+ YOEBachelor's in Materials Science, Chemical Engineering, or Electrical Engineering with 3+ years, or Master's with 2+ years; semiconductor device design/fabrication experience; cleanroom proficiency; DOE and statistical analysis; MS Office; strong communication and organizational skills.
7+ YOEMS or PhD in Electrical Engineering, Applied Physics, or Materials Science; 7+ years in laser diode design; strong modeling and simulation; DOE experience; proficient in Python/MATLAB; device characterization
7+ YOEMS or PhD in Electrical Engineering, Applied Physics, or Materials Science; 7+ years in laser diode design; strong modeling, simulation, and data analysis; DOE experience; cross-functional collaboration.
Photon Design, COMSOL, Lumerical, MATLAB, Python, JMP, DOE
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBachelor’s degree in Electrical/Computer Science or related field with 5-10 years experience, or Master’s/PhD with 3-5 years; strong thermo-mechanical FEA and multi-material systems experience; proficiency with ANSYS/Abaqus/COMSOL; semiconductor packaging knowledge.