35 microelectronics process engineer jobs at 17 companies in United States
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Microelectronics Process Engineer/Principal Microelectronics Process Engineer
Linthicum, Maryland, United States
$88k-$136k/yr OnsiteFull Time
2+ YOEBachelor's in engineering (chemical, electrical, mechanical or related) with 2+ years (or higher degree with equivalent), experience in semiconductor fab/test, automation and equipment procurement, SOLIDWORKS/AutoCAD/Creo experience, U.S. citizenship, and ability to obtain Top Secret/SCI.
SOLIDWORKS, AutoCAD, Autodesk, Creo
4w
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Microelectronics Process Engineer/Principal Microelectronics Process Engineer
Linthicum Heights, Maryland, United States
$88k-$131k/yr OnsiteFull Time
2+ YOEBachelor's in STEM, U.S. citizenship, ability to obtain Top Secret/SCI, 2+ years (up to 5+ for principal) semiconductor fab/test experience, SOLIDWORKS/AutoCAD/Autodesk/Creo experience, automation and equipment procurement experience.
SOLIDWORKS, AutoCAD, Autodesk, Creo
1mo
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Microelectronics Process Engineer (Optical Products)
Redmond, Washington, United States
$105k-$150k/yr OnsiteFull Time
1+ YOEBachelor's in engineering or physics, 1+ years hands-on microelectronics assembly experience, proficiency with CAD/SQL/Python, experience with die/wire bonding, AOI, SPC/DOE, failure analysis tools; must be able to lift 25 lbs and work weekends/extended hours. ITAR-restricted U.S. status required.
CAD, SQL, Python, AOI, SMT, PCBA, SPC, DOE, CPK, OEE, MIL-STD-883, IPC-610, JEDEC, shear test, pull test, X-ray, SAM
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Senior Systems Engineer - Microelectronics
Fort Meade, Maryland, United States
$132k-$290k/yr OnsiteFull Time
6+ YOEActive TS/SCI with polygraph, strong microelectronics and SIGINT knowledge, test engineering experience, excellent communication, and ability to support ISO/IEC 15288 processes.
ISO/IEC 15288
1mo
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Sr Process Engineer
Woburn, Massachusetts, United States
OnsiteFull Time
7+ YOEBachelor's in engineering, 7+ years in electronics/microelectronics manufacturing or process engineering, hands-on SMT and PCB assembly experience, IPC/soldering knowledge, DOE/SPC proficiency, and experience leading cross-functional projects.
pick and place machines, reflow ovens, AOI/AXI, wave/selective solder, auto bonding equipment, conformal coating, SPC, DOE, PFMEA, 8D, DMAIC, SAP, Oracle, Honeywell Forge
1mo
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Materials Microelectronics Engineer (Lexington, MA, US)
Lexington, Massachusetts, United States
$116k-$182k/yr OnsiteFull Time
MS in EE/ME/Materials required; experience in semiconductor/MEMS microfabrication, process integration, metrology, DOE, device testing, and programming (MATLAB, Python, LabVIEW); strong lab, problem-solving, and communication skills.
MATLAB, Python, LabVIEW
2mo
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Semiconductor Process Engineer
Boise, Idaho, United States
OnsiteFull Time
Master’s degree in Electrical Engineering, Computer Engineering, Microelectronics, Physics, Materials Science or related field; strong background in semiconductor device physics, fabrication, electrical characterization, and programming.
MATLAB, Python, C/C++, Sentaurus, Agilent 4155C, B1500, E8362B, oscilloscopes, VF-TLP-PB systems, probe stations
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Senior Quality Engineer - Thick Film & Microelectronics Assembly
Canton, Massachusetts, United States
$110k-$160k/yr OnsiteFull Time
3+ YOEBachelor's in engineering or materials science, 3+ years quality engineering in microelectronics/semiconductor manufacturing, experience with thick film processes, AS9100/ISO9001 familiarity, root cause analysis, SPC/DoE, and APQP/PPAP/DFMEA/PFMEA.
AS9100, ISO 9001, SPC, DoE, APQP, PPAP, DFMEA, PFMEA, MIL Standard
2mo
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Process Integration Engineer - DRAM, DMTS
Boise, Idaho, United States
OnsiteFull Time
11+ YOEMS (required) in EE/Microelectronics/Materials Science, 10+ years industry BEOL/DRAM experience, expertise in metallization/liner/dielectric integration, process transfer and yield improvement, leadership and technical publications/patents.
1w
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Microelectronics Systems Integration Engineer
Houston or Pennsylvania
FieldFull Time
10+ YOE10+ years experience with UPW/wastewater systems for semiconductor or high-purity facilities; strong UPW process knowledge (RO, EDI, IX, degasification, UV, TOC); commissioning, startup, troubleshooting, and technical communication skills.
PFD, P&ID, GA, RO, EDI, IX, UV, TOC
2d
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2nd Shift Etch Process Support Engineer
Andover, Massachusetts, United States
$69k-$131k/yr OnsiteFull Time
3+ YOEBachelor's in STEM, 3+ years microelectronics processing experience (wet/dry etching, plating), U.S. citizenship and active DoD Secret clearance, strong communication and data analysis skills.
MATLAB, Python, SQL, JMP
2w
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Senior/Principal Microelectronics Equipment Technologist - Advanced Thin Films & Processing, Onsite
Albuquerque, New Mexico, United States
$75k-$144k/yr OnsiteFull Time
3+ YOEAssociates in electromechanical/engineering tech or HS+3yrs experience; significant vacuum thin-film deposition equipment maintenance experience; mechanical aptitude; ability to obtain DOE Q-level security clearance.
AutoCAD, SolidWorks, PLC
1w
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Senior Electrical Engineer
Eglin AFB, Florida, United States
OnsiteFull Time
12+ YOEU.S. citizen with Bachelors in engineering,12+ years electrical engineering experience, active Secret DoW clearance and eligibility for Top Secret, familiarity with microelectronics, test/qualification, military standards, and DoW acquisition processes.
1mo
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Microelectronics (ME) Surface Mount Technology (SMT) Circuit Card Assembly (CCA) Engineer
Tobyhanna, Pennsylvania, United States
$72k-$150k/yr OnsiteFull Time
5+ YOEUS citizen with REAL ID/passport; 5+ years SMT CCA manufacturing/repair/testing experience (or 2-year EET +10 years); experience with SMT process development and PCB design/layout; Automated Test System design; EM and inspection system familiarity.
Mycronic MYCenter CAD/BOM, MYPlan, MYTrace, Altium Designer Pro, Cadence OrCAD X, AutoCAD 2D & 3D, National Instruments Test Stand, LabVIEW, 3D CT X-ray Inspection Systems, Automated Optical Inspection (AOI) Systems, Solder Paste Inspection (SPI) Systems, Component Pick & Place Systems
1mo
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Associate Engineer
Newburyport, Massachusetts, United States
$62k-$84k/yr OnsiteFull Time
3+ YOEBachelor's degree in microelectronics/physics/electrical engineering, ~3 years related experience preferred, knowledge of semiconductor device/process technologies, FA tool experience, strong communication and attention to detail.
Chemical de-processing, Plasma de-processing, Cross sectioning, Junction staining, Optical microscopy, SEM microscopy, EDS, SEM Backscatter, Laser Isolation, FIB (Focused Ion Beam), C-SAM (Scanning Acoustic Microscopy), JEOL IT700HR, EDAX, JEOL 6401FV, Polishers, Reactive Ion Etcher, Jet etcher, X-ray
1mo
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Advanced Packaging Engineer
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yr OnsiteFull Time
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
1mo
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Advanced Packaging Engineer
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yr OnsiteFull Time
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
1mo
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Electromechanical Packaging Engineer
Torrance, California, United States
$150k-$200k/yr HybridFull Time
5+ YOEBS in mechanical or electrical engineering required, 5+ years microelectronics packaging or PCB design experience, knowledge of foundry/chip scale processes, CAD and schematic skills, tape-out and DFM familiarity; hybrid on-site minimum 3 days/week.
Creo, NX, Catia, GD&T, Altium, Cadence, Mentor
2w
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Sr Microelectronic Manufacturing Engineer I
Eden Prairie, Minnesota, United States
$94k-$128k/yr OnsiteFull Time
10+ YOEB.S. in engineering or physical science, minimum 10 years process/manufacturing engineering experience including PCB/component failure analysis, DOE/SPC, process validation, and supplier collaboration.
DMAIC, Design of Experiments (DOE), Statistical Process Control (SPC), Automated Test System Verification (ATSV), Microelectronic packaging design tools
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Manager 1 - Product Engineering
Nashua, New Hampshire, United States
OnsiteFull Time
5+ YOEBachelor's in electrical/electronics/materials engineering, 5+ years microelectronics/fab experience, RF technology support, leadership experience, cleanroom/process knowledge, SPC/DoE proficiency, ability to obtain Secret clearance.
Network Analyzers, Spectrum Analyzers, Statistical Process Control (SPC), Design of Experiments (DoE)
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