11 module development engineer jobs at 5 companies in Arizona
3w
Save
Mark Applied
Hide
Packaging Module Development Engineer
Phoenix or Chandler
$115k-$220k/yr HybridFull Time
1+ YOEPhD or Master's in engineering/physics/materials,1+ year experience in mechanical design/equipment development,strong experimental and prototype background,publication record for PhD candidates.
1w
Save
Mark Applied
Hide
Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
3mo
Save
Mark Applied
Hide
Packaging Module Development Engineer
Phoenix, Arizona, United States
$115k-$220k/yr OnsiteFull Time
3+ YOEMaster's degree in Mechanical, Materials, Electrical Engineering, Physics/Applied Physics or related; 3+ years experience or PhD; programming (Python, MATLAB); AI/ML; semiconductor packaging experience; onsite presence.
Python, MATLAB, Artificial Intelligence, Machine Learning
1mo
Save
Mark Applied
Hide
Module Development Engineer - RF Test
Phoenix or Chandler
$115k-$220k/yr OnsiteFull Time
3+ YOEUS citizenship and ability to obtain TS/SCI clearance; degree in electrical engineering or related STEM with relevant experience; 3+ years RF design/test and IC/ATE experience; proficiency with lab equipment, HFSS/ADS/PowerSI, Cadence Allegro; programming (Python/MATLAB/LabVIEW) preferred.
BERTS, mixed-signal oscilloscopes, spectrum analyzers, signal analyzers, network analyzers, signal generators, VNAs, TDRs, automatic test equipment (ATE), HFSS, ADS, PowerSI, Cadence Allegro, Python, MATLAB, LabVIEW
1mo
Save
Mark Applied
Hide
Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation
1d
Save
Mark Applied
Hide
Packaging Module Development Engineer
Phoenix, Arizona, United States
$134k-$189k/yr OnsiteFull Time
1+ YOEBachelor's degree with 4+ years, master's with 3+ years, or PhD with 1+ years relevant engineering experience; metrology development, measurement analysis, electrical and optical measurement experience required.
Microsoft Excel, Python, SQL, machine vision
1w
Save
Mark Applied
Hide
Sr Staff Package Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
2mo
Save
Mark Applied
Hide
ServiceNow Developer, Configuration & Integrations Consultant
Gilbert or Lake Mary or Mechanicsburg
HybridFull Time
3+ YOEBachelor's degree, U.S. citizen eligible for Public Trust clearance, 3+ years ServiceNow development, experience with ServiceNow modules (ITSM, ITOM, ITAM, CSM, SPM), hybrid residency near a US Delivery Center, up to 10% overnight travel.
ServiceNow, IntegrationHub, Flow Designer, CMDB, Information Technology Service Management (ITSM), Information Technology Operations Management (ITOM), Information Technology Asset Management (ITAM), Customer Service Management (CSM), Strategic Portfolio Management (SPM)
1w
Save
Mark Applied
Hide
Sr. Software Engineer II - Front End (Apex Platform)
Scottsdale or Los Angeles
$120k-$135k/yr HybridFull Time
6+ YOE6+ years front-end engineering experience with HTML,CSS,JavaScript,TypeScript, SPAs, module federation and micro front-end architectures; Git and CI/CD experience; leadership and mentoring experience.
Mico Front Ends, Module Federation, HTML, CSS, JavaScript, TypeScript, Single Page Applications, Rect, Git, CI/CD, C#, .NET core, AWS, Terraform, Docker, Kafka, TDD, BDD, Elasticsearch, AWS DynamoDB
1mo
Save
Mark Applied
Hide
Senior Technical Lead, New Product Development, SiC & Si Power Discretes/Modules
Scottsdale or San Jose
OnsiteFull Time
10+ YOEMaster's/PhD in EE/Materials/Physics, 10+ years in power semiconductor product development (SiC/Si MOSFET preferred), deep device and packaging expertise, proven cross-functional leadership, escalation and executive communication skills.
3w
Save
Mark Applied
Hide
Windchill Technical Lead
Tucson, Arizona, United States
$120k-$140k/yr OnsiteFull Time
8+ YOEExperience developing, configuring, customizing and integrating Windchill modules (PDMLink, ProjectLink, MPMLink) using Java and Windchill APIs; CI/CD knowledge; Bachelors in Computer Science; strong stakeholder, planning and mentoring skills.
Java, Windchill, PDMLink, ProjectLink, MPMLink, Windchill APIs, CI/CD Pipeline, PLM