Battle Ground • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Battle Ground • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Battle Ground • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Battle Ground • 50 milesRemote · Hybrid · Onsite · Field · All Environments
17 module development engineer jobs at 1 company in Battle Ground, WA
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Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr OnsiteFull Time
1+ YOEPhD (STEM) +1 yr or Master's +4 yrs; experience in manufacturing process development, statistical process control, data analytics, wafer-level assembly, and advanced packaging; strong problem-solving and cross-functional collaboration skills.
3w
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HBI Module Development Engineer
Hillsboro, Oregon, United States
$156k-$298k/yr HybridFull Time
5+ YOEAdvanced degree in materials/science/engineering with 5+ years industry experience in hybrid or wafer bonding; expertise in process/equipment development, DOE and statistical analysis, metrology, and cross‑functional collaboration.
2mo
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Module Development Engineer
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
10+ YOEPhD (10+ years) or Master’s (15+ years) in a related field; strong dry etch semiconductor process expertise; leadership across projects and cross-functional teams.
Dry etch equipment, SEM, TEM, XPS, DOE, statistical modeling
2w
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Module Development Engineer
Hillsboro, Oregon, United States
$134k-$189k/yr OnsiteFull Time
0.5+ YOEPhD in a STEM field with at least 6 months relevant experience; knowledge of plasma physics, thin film processes, experimental design, data analysis, and semiconductor process integration.
Python, MATLAB, JMP, Lam, Applied Materials, TEL, ASM, Hitachi, SEM, TEM, AFM, XPS, ellipsometry
1mo
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WATD Module Development Engineer
Hillsboro, Oregon, United States
$156k-$220k/yr OnsiteFull Time
2+ YOESTEM degree with 2–6+ years experience (depending on degree), experience in development methodologies, statistical process control, data analytics, and wafer-level assembly or semiconductor equipment; strong collaboration and technical leadership.
2mo
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Intel Foundry Module Development Engineer
Hillsboro, Oregon, United States
$156k-$220k/yr HybridFull Time
7+ YOEPhD in a STEM field with 7+ years semiconductor industry experience; overlay development experience; strong communication and cross-functional collaboration.
EUV lithography, DUV lithography, semiconductor fabrication, design of experiments, statistical process control
3d
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Module Development Engineer, Defect Inspection
Hillsboro, Oregon, United States
$134k-$189k/yr OnsiteFull Time
4+ YOEBachelor's degree in engineering/materials/physics/chemistry with 4+ years (alternatively MS+3 or PhD+2); experience in semiconductor processing, SPC/DOE, process troubleshooting, and inspection/metrology.
1mo
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Intel Foundry Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr HybridFull Time
1+ YOEMaster's +5 yrs or PhD +1 yr in a relevant STEM field; hands-on experimental research experience; semiconductor processing, chemical processing, wet etch, process control, statistics, and project leadership preferred.
1w
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Intel Foundry Module Development Engineer
Hillsboro, Oregon, United States
$134k-$189k/yr HybridFull Time
2+ YOEPhD in a relevant science/engineering field,2+ years experimental lab work,experience with equipment troubleshooting,knowledge of C# or Python,ML/AI familiarity preferred.
C#, Python
1w
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Module Engineer
Hillsboro, Oregon, United States
$144k-$171k/yr OnsiteFull Time
Doctorate in a STEM field, expertise in manufacturing/process development, equipment optimization, troubleshooting, and technology transfer for high-volume semiconductor production.
2w
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Dry Etch module development engineer
Hillsboro, Oregon, United States
$134k-$255k/yr HybridFull Time
4+ YOEIndustry dry etch experience from leading equipment suppliers or foundries, hands-on etch process development, plasma etch fundamentals, DOE/statistical analysis experience, and ability to lead cross-functional technical problem solving.
JMP, Python, MATLAB
4d
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Module Development Engineering Manager
Hillsboro, Oregon, United States
$134k-$220k/yr OnsiteFull Time
Bachelor's+6yrs or Master's+4yrs or PhD+2yrs in engineering/materials/physics; leadership experience; expertise in optical characterization, scripting, statistics, data analytics, problem solving; familiarity with metrology, wafer equipment, and packaging technologies preferred.
1mo
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Module Development Defect Inspection Engineer
Hillsboro, Oregon, United States
$115k-$220k/yr OnsiteFull Time
5+ YOESTEM degree (BS/MS/PhD) with 4–5+ years experience in semiconductor processing, wafer-level assembly, cleanroom, process development, and module or fab process/hardware technology.
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Advanced Packaging Dry Etch Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr OnsiteFull Time
2+ YOEMaster's or PhD in engineering/physical science with process development experience in semiconductor manufacturing; experience with DOE, plasma etch equipment, and driving programs to production.
3d
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Principal Engineer, Module Development – CMP
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
15+ YOEMaster's degree in engineering/science required (PhD preferred); 15+ years semiconductor experience; 10+ years CMP process development; CMP equipment and consumables expertise; data-driven root-cause analysis; cross-functional leadership.
1w
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Module Development Defect Inspection Engineer
Hillsboro, Oregon, United States
$134k-$189k/yr OnsiteFull Time
2+ YOEBachelor's/MS/PhD in STEM with 2–3+ years semiconductor or process development experience; expertise in process development, metrology, and equipment/materials integration.
2mo
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Principal Engineer, Hybrid Bonding Module
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
15+ YOEExpert in hybrid bonding and advanced packaging; lead module development, FOK equipment, and high-volume manufacturing readiness; strong communication and mentoring skills.
Hybrid bonding, Wafer bonding, Advanced packaging, Process development, Yield improvement, Reliability enhancement, FOK platform development