16 module development engineer jobs at 1 company in Milwaukie, OR
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Module Development Engineer
Hillsboro, Oregon, United States
$99k-$140k/yr OnsiteFull Time
0.5+ YOEBachelor's degree in mechanical engineering or related STEM field, 6+ months of experience, and experience with mechanical design, CAD, SolidWorks, DriveWorks, RSS analysis, GD&T, or finite element analysis.
CAD, SolidWorks, DriveWorks, RSS, Finite Element Analysis
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Module Development Engineer
Hillsboro, Oregon, United States
$99k-$163k/yr OnsiteFull Time
4+ YOEBachelor's degree in mechanical engineering or related STEM field with 4+ years' experience, or master's degree with 2+ years. Requires mechanical design, CAD, analysis, and full-cycle project management experience.
CAD, SolidWorks, DriveWorks, RSS, Geometric Dimensioning, Finite Element Analysis
1d
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Packaging Module Development Engineer
Hillsboro, Oregon, United States
$115k-$220k/yr OnsiteFull Time
4+ YOEBachelor's degree with 4+ years, master's with 3+ years, or Ph.D. in a relevant field; 4+ years in packaging module development, process characterization, or equipment optimization.
Design of Experiments (DOE)
2mo
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Module Development Engineer
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
10+ YOEPhD (10+ years) or Master’s (15+ years) in a related field; strong dry etch semiconductor process expertise; leadership across projects and cross-functional teams.
Dry etch equipment, SEM, TEM, XPS, DOE, statistical modeling
3w
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Module Development Engineer
Hillsboro, Oregon, United States
$134k-$189k/yr OnsiteFull Time
0.5+ YOEPhD in a STEM field with at least 6 months relevant experience; knowledge of plasma physics, thin film processes, experimental design, data analysis, and semiconductor process integration.
Python, MATLAB, JMP, Lam, Applied Materials, TEL, ASM, Hitachi, SEM, TEM, AFM, XPS, ellipsometry
1mo
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WATD Module Development Engineer
Hillsboro, Oregon, United States
$156k-$220k/yr OnsiteFull Time
2+ YOESTEM degree with 2–6+ years experience (depending on degree), experience in development methodologies, statistical process control, data analytics, and wafer-level assembly or semiconductor equipment; strong collaboration and technical leadership.
1mo
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Intel Foundry Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr HybridFull Time
1+ YOEMaster's +5 yrs or PhD +1 yr in a relevant STEM field; hands-on experimental research experience; semiconductor processing, chemical processing, wet etch, process control, statistics, and project leadership preferred.
2w
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Intel Foundry Module Development Engineer
Hillsboro, Oregon, United States
$134k-$189k/yr HybridFull Time
2+ YOEPhD in a relevant science/engineering field,2+ years experimental lab work,experience with equipment troubleshooting,knowledge of C# or Python,ML/AI familiarity preferred.
C#, Python
2w
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Module Engineer
Hillsboro, Oregon, United States
$144k-$171k/yr OnsiteFull Time
Doctorate in a STEM field, expertise in manufacturing/process development, equipment optimization, troubleshooting, and technology transfer for high-volume semiconductor production.
3w
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Dry Etch module development engineer
Hillsboro, Oregon, United States
$134k-$255k/yr HybridFull Time
4+ YOEIndustry dry etch experience from leading equipment suppliers or foundries, hands-on etch process development, plasma etch fundamentals, DOE/statistical analysis experience, and ability to lead cross-functional technical problem solving.
JMP, Python, MATLAB
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Thin Films Module Development Engineering
Hillsboro, Oregon, United States
$134k-$255k/yr OnsiteFull Time
5+ YOEBachelor's degree plus 5+ years, master's plus 3+ years, or PhD plus 1+ years in a relevant STEM field. Experience in process development, SPC, data analytics, semiconductor processing, or advanced packaging required.
CVD, PECVD, ALD, PVD
1w
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Module Development Engineering Manager
Hillsboro, Oregon, United States
$134k-$220k/yr OnsiteFull Time
Bachelor's+6yrs or Master's+4yrs or PhD+2yrs in engineering/materials/physics; leadership experience; expertise in optical characterization, scripting, statistics, data analytics, problem solving; familiarity with metrology, wafer equipment, and packaging technologies preferred.
1mo
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Advanced Packaging Dry Etch Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr OnsiteFull Time
2+ YOEMaster's or PhD in engineering/physical science with process development experience in semiconductor manufacturing; experience with DOE, plasma etch equipment, and driving programs to production.
1w
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Principal Engineer, Module Development – CMP
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
15+ YOEMaster's degree in engineering/science required (PhD preferred); 15+ years semiconductor experience; 10+ years CMP process development; CMP equipment and consumables expertise; data-driven root-cause analysis; cross-functional leadership.
2w
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Module Development Defect Inspection Engineer
Hillsboro, Oregon, United States
$134k-$189k/yr OnsiteFull Time
2+ YOEBachelor's/MS/PhD in STEM with 2–3+ years semiconductor or process development experience; expertise in process development, metrology, and equipment/materials integration.
2mo
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Principal Engineer, Hybrid Bonding Module
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
15+ YOEExpert in hybrid bonding and advanced packaging; lead module development, FOK equipment, and high-volume manufacturing readiness; strong communication and mentoring skills.
Hybrid bonding, Wafer bonding, Advanced packaging, Process development, Yield improvement, Reliability enhancement, FOK platform development