AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Develop and scale advanced manufacturing processes for display and touch technologies; problem-solve cross-functionally; support product engineering validation builds.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Experience developing manufacturing process technologies, cross-disciplinary problem solving, and carrying process modules from concept through product engineering validation.
NokiaNYSE: NOK: Sells telecommunications infrastructure and software for global network operators.
10+ YOEBS/MS in Mechanical Engineering, 10+ years designing telecom networking products; proficiency with CREO and Windchill PLM; experience with circuit packs, sheet metal chassis, pluggable modules, tolerance analyses, shock/vibration; knowledge of NEBS/ETSI/ANSI.
R&D AI & Intelligent Tool Development Engineer, Joint Development Modules (7735)
San Jose or Palo Alto or Austin or United States or Taiwan or North America or Asia or Europe
$150k-$250k/yrHybridFull Time
TSMCNew York Stock Exchange: TSM: Manufactures advanced semiconductor integrated circuits for global technology companies.
2+ YOEPh.D. in a STEM field with 2–10 years experience; expertise in closed-loop control, sensor fusion, predictive maintenance, Agentic AI/LLM integration, and digital twin/process modeling; strong cross-functional communication.
Hardware Engineering Active Electric Cable / Smart Cable Module, AVP
San Jose, California, United States
OnsiteFull Time
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
Senior technical leader with proven experience leading engineering development for high-speed electrical interconnect products and cable manufacturing; R&D, product development, roadmap ownership, multidisciplinary team management, and experience with overseas (Asia) contract manufacturers.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Design and develop mobile display modules from concept to mass production, lead projects, and collaborate with internal and external partners to deliver high-performance, reliable display solutions.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
15+ YOE15+ years in semiconductor package development with expertise in Power SiP/modules, flip‑chip and wafer‑level packaging; experience leading R&D, NPI, OSAT qualification, SPC and statistical methods.
Product Integration, Senior Principal - Active Electric Cable / Smart Cable Module Business
San Jose or Asia
OnsiteFull Time
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
15+ YOEBachelor's in EE/CE required; 15+ years hardware product development experience with high-speed interconnects; deep signal integrity, PCB, cable, firmware/hardware integration knowledge; willingness to travel 20–30%.
HFSS, ADS, CST, COSMOS, Oscilloscope, BER tester, VNA, TDR
Credo SemiconductorNASDAQ: CRDO: Designing high-speed semiconductor connectivity solutions for data infrastructure.
8+ YOEB.S. or M.S. in EE/CE/CS/Photonics, 8+ years in test automation/instrumentation/optical systems, strong Python/C++, experience with SCPI, PyVISA/VISA, Linux, DCAs, VNAs, optical switches/VOAs, and knowledge of PAM4 and high-speed modules.
PolyExplore: Develops high-precision mobile mapping and navigation technology.
Master's degree in computer science/engineering, ability to program and test map-editing modules, evaluate algorithms, validate systems, and provide technical support.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Coordinate cross-functional hardware, optics, software, mechanical, and operations teams to drive design, development, and integration of camera and depth modules for iPhone, iPad, and Mac.