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4 optoelectronics engineer jobs at 3 companies in Hellertown, PA

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Process and Integration Engineer, Optoelectronics
Breinigsville, Pennsylvania, United States
$110k-$176k/yr OnsiteFull Time
Broadcom
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEMaster's in Materials/Optical/Chemical/Electrical Engineering, 6+ years semiconductor manufacturing (4+ years thin-film deposition), expertise in IBS/ALD, vacuum physics, SPC/DOE/FMEA/DMAIC, and tools such as JMP, SQL, and Tableau.
Ion Beam Sputtering (IBS), ALD, SPC, DOE, FMEA, OCAP, DMAIC, JMP, SQL, Tableau, spectroscopic ellipsometry, spectrophotometry, AFM, Automated Visual Inspection (AVI), Pick-and-Place (PnP)
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Principal Process Engineer
Allentown, Pennsylvania, United States
$125k-$232k/yr OnsiteFull Time
Nokia
NokiaNYSE: NOK: Sells telecommunications infrastructure and software for global network operators.
6+ YOEBS in Engineering with 6–10 years' experience or MS in Engineering with 5+ years. Requires optoelectronic assembly, process development, CAD, statistical analysis, and high-volume manufacturing experience.
Creo, SolidWorks, Design of Experiments (DOE), Failure Mode Effects Analysis (FMEA), Failure Mode Analysis (FMA), Root Cause Corrective Action (RCCA), CAD
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Process Development Engineer
Allentown, Pennsylvania, United States
$88k-$163k/yr OnsiteFull Time
Nokia
NokiaNYSE: NOK: Sells telecommunications infrastructure and software for global network operators.
3+ YOEEngineering BS with 3–6 years' experience or MS with 0–4 years; hands-on optoelectronic assembly and process development experience; CAD, DOE, statistical analysis, mechanical drawings, and cross-functional communication skills.
CAD, Creo, SolidWorks, Design of Experiments (DOE), Failure Mode Effects Analysis (FMEA), Failure Mode Analysis (FMA), Root Cause Corrective Action (RCCA)
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Optoelectronic IC Package Design Director
New Providence, New Jersey, United States
$236k-$376k/yr OnsiteFull Time
Ciena
CienaNYSE: CIEN: Provides high-speed optical networking and network automation solutions.
10+ YOEBS in Electrical Engineering or Physics required,10+ years IC package design experience,SI/PI and EM simulation expertise,package development and tapeout experience,experience with APD/XPD/Cadence/SIWave/HFSS.
Advanced Package Designer (APD), SIP, Xpedition Package Designer (XPD), Cadence, SIWave, HFSS
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