6 packaging design engineer jobs at 2 companies in Cheyenne, WY
4w
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
2w
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CPU Core Physical Design Thermal Modeling Lead
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yr HybridFull Time
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
EDA, SoC, IP
1mo
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ASIC Package Design Manager
Fort Collins, Colorado, United States
$144k-$230k/yr OnsiteFull Time
12+ YOE3+ Mgmt12+ years in flip-chip-BGA package design with high-speed SerDes, knowledge of SI/PI and power integrity, project and people management experience, BSEE/MSEE or similar, and ability to collaborate globally.
1w
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System Signal/Power Integrity Engineer
San Jose or Fort Collins
OnsiteFull Time
12+ YOERequires BS with 12 years, MS with 10 years, or PhD with 7 years in Electrical Engineering or Physics, plus expertise in signal integrity, electromagnetic theory, power integrity, package design, or photonics.
Ansys HFSS, SIWave, Q3D, Polar, Keysight ADS, Matlab, Cadence APD, Allegro, Linux, Keysight AEL, VNA, TDR
3d
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2027 Masters ASIC Package Engineering Co-op/Intern
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
$80k-$120k/yr HybridInternship, Contract
Currently enrolled in a U.S. master's program in engineering or related field; knowledge of circuits, package/PCB design software, Perl, Python, SQL, semiconductor packaging, or data analytics preferred.
Perl, Python, SQL, Power BI
3d
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2027 Undergrad ASIC Package Engineering Co-op/Intern
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
HybridInternship, Temporary
Currently enrolled in a US bachelor's program in engineering or a related field; knowledge of circuits, package or PCB design, Perl, Python, SQL, semiconductor packaging, or data analytics is encouraged.
Perl, Python, SQL, Power BI