10 packaging design engineer jobs at 5 companies in Fort Collins, CO
4w
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
3mo
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Engineering Design Package Electrical Engineer
Longmont or Greenville or Roanoke or Schenectady
$90k-$120k/yr OnsiteFull Time
3+ YOEBachelor’s in Electrical Engineering; 3+ years in installation packages/field engineering in power/industrial settings; travel ~15%; strong communication and customer interaction.
Electrical drawings, Cable schedules, Power bus routing, Equipment arrangements, Specifications generation, Field engineering, Interconnection drawings, Turbine control products, GE Excitation
2w
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CPU Core Physical Design Thermal Modeling Lead
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yr HybridFull Time
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
EDA, SoC, IP
1mo
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ASIC Package Design Manager
Fort Collins, Colorado, United States
$144k-$230k/yr OnsiteFull Time
12+ YOE3+ Mgmt12+ years in flip-chip-BGA package design with high-speed SerDes, knowledge of SI/PI and power integrity, project and people management experience, BSEE/MSEE or similar, and ability to collaborate globally.
4d
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Senior Engineer, High Voltage Development
Louisville, Colorado, United States
$156k-$160k/yr HybridFull Time
6+ YOEBachelor's degree in Electrical Engineering or related field and 6 years of high-voltage design experience. Requires substation, generation tie, utility coordination, EPC bid, due diligence, design-package management, and estimating experience.
AutoCAD, Bluebeam, ETAP, OpenDSS, Google Earth, Microsoft Suite, IEEE, NESC, NFPA, ISO, NERC, CAISO, HECO, Xcel, Tri State, PacifiCorp
1w
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System Signal/Power Integrity Engineer
San Jose or Fort Collins
OnsiteFull Time
12+ YOERequires BS with 12 years, MS with 10 years, or PhD with 7 years in Electrical Engineering or Physics, plus expertise in signal integrity, electromagnetic theory, power integrity, package design, or photonics.
Ansys HFSS, SIWave, Q3D, Polar, Keysight ADS, Matlab, Cadence APD, Allegro, Linux, Keysight AEL, VNA, TDR
1mo
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Packaged Systems Engineer
Longmont or Greenville
$90k-$105k/yr HybridFull Time
5+ YOEBachelor's in Engineering and at least 5 years' experience designing and integrating DCS/PLC and BOP cabinet systems for power plant applications; proficiency with AutoCAD Electrical, Autodesk Inventor, PLM tools; willingness to travel up to 10%.
DCS, PLC, AutoCAD Electrical, AutoCAD Electrical 2020, Autodesk Inventor, Teamcenter, PLM tools
3d
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2027 Masters ASIC Package Engineering Co-op/Intern
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
$80k-$120k/yr HybridInternship, Contract
Currently enrolled in a U.S. master's program in engineering or related field; knowledge of circuits, package/PCB design software, Perl, Python, SQL, semiconductor packaging, or data analytics preferred.
Perl, Python, SQL, Power BI
3w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
3d
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2027 Undergrad ASIC Package Engineering Co-op/Intern
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
HybridInternship, Temporary
Currently enrolled in a US bachelor's program in engineering or a related field; knowledge of circuits, package or PCB design, Perl, Python, SQL, semiconductor packaging, or data analytics is encouraged.
Perl, Python, SQL, Power BI