13 packaging design engineer jobs at 8 companies in Oregon
4w
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Silicon Packaging Design Engineer
Phoenix or Hillsboro or Chandler
$164k-$232k/yr OnsiteFull Time
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
Cadence Allegro, Cadence Constraint Manager, Siemens Xpedition, Product Lifecycle Management (PLM)
3mo
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Silicon Packaging Design Engineer
Phoenix or Hillsboro
$106k-$200k/yr OnsiteFull Time
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
Virtuoso, Innovus, FusionCompiler, ICvalidator, Calibre
3w
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Senior Mask Design Engineer – Hardware
Santa Clara or Nevada or Washington or Arizona or Oregon or California
$136k-$259k/yr HybridFull Time
5+ YOEBachelor's degree in electrical engineering or equivalent experience; 5+ years in mask and layout design; Cadence Virtuoso, verification tools, scripting, DRC/LVS, and packaging knowledge.
Cadence, Virtuoso, Integrity, Calibre, ICV, Thunder, Perl, Python, Skill, APD, DRC, LVS
1d
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Mechanical Product Design Engineer II
Portland, Oregon, United States
HybridFull Time
2+ YOEBachelor's degree in engineering and 2–4 years of related experience required. Requires CAD, engineering documentation, chassis packaging, communication, and general office application proficiency.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint, CAD, NX, Imacs, Smaragd, ERS, Power BI, VBA
3d
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Mechanical Product Design Engineer II
Portland, Oregon, United States
$86k-$110k/yr HybridFull Time
2+ YOEBachelor's degree in mechanical engineering or related discipline and 2–4 years of related experience. Requires CAD and engineering documentation proficiency; NX, vehicle packaging, and product development experience preferred.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint, CAD, NX, IMACS, IMACS+, PLATON, ERS, Shainin RedX, Six Sigma, 8D, ZEUS, FRACAS
6d
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Director of Package Design
Mountain View or Redmond or Hillsboro or Austin or Raleigh
$143k-$275k/yr HybridFull Time
3+ YOERequired: doctorate plus 3+ years, master's plus 6+ years, bachelor's plus 8+ years, or equivalent. Preferred: 15+ years semiconductor package experience and advanced packaging, CAD, simulation, supplier, and manufacturing expertise.
Cadence Allegro, EDA, BGA
1mo
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Staff Mechanical Engineer
Fremont or Salem
$185k-$240k/yr HybridFull Time
8+ YOE8+ years mechanical design experience, B.S./M.S. in Mechanical Engineering, experience with mechanism design, electronics packaging, FEA/thermal analysis, Creo, Windchill, Jira/Confluence; ability to mentor engineers.
Creo, Windchill, Jira, Confluence
1w
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Signal and Power Integrity Engineer
Raleigh or Redmond or Austin or Hillsboro or Mountain View
$102k-$202k/yr HybridFull Time
1+ YOEMaster’s degree plus 1+ year or bachelor’s degree plus 2+ years in technical engineering; 5+ years of signal and power integrity, system design, electrical modeling, or silicon packaging experience preferred.
3w
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Senior Package Layout Engineer - Hardware
Santa Clara or Nevada or Washington or Arizona or Oregon or California
$136k-$259k/yr HybridFull Time
5+ YOEBachelor's degree in electrical engineering or equivalent experience, 5+ years of PCB layout experience, and expertise with Cadence APD or SiP, high-speed design, substrate layout, and PCB layout tools.
Cadence APD, SiP, Constraint Manager, Virtuoso, Calibre, Valor, CAD
2mo
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Electrical Field Engineer (Thacker Pass, NV, US, 89425)
Thacker Pass or Winnemucca or Reno or Oregon
$105k-$160k/yr OnsiteFull Time
8+ YOEProvide technical oversight of electrical construction, supervise crews, prepare work packages and material requisitions, inspect installations, perform quantity takeoffs, and resolve design/constructability issues; 8+ years experience desired.
ACONEX, TEAMWorks, Bechtel Productivity System, PTR, eSub
6d
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Structural Designer
Hillsboro, Oregon, United States
$50k-$70k/yr HybridFull Time
1+ YOEHigh school or associate degree in architectural design, engineering design, or drafting; 1–2+ years using AutoCAD or Revit for engineering or architectural design packages; industrial design experience preferred.
AutoCAD, Revit, BIM, AI Large Language Models
3w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
3w
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Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yr HybridFull Time
12+ YOEBS, MS, or PhD in electrical engineering, physics, or computer engineering; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional system-manufacturing design.
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