11 packaging design engineer jobs at 7 companies in Orlando, FL
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Package Design Engineer | Semiconductor
Apopka or Raleigh
OnsiteFull Time
Micross: Private manufacturer of high-reliability microelectronic components and services for aerospace, defense, space, medical, industrial, and commercial markets.
8+ YOEBachelor's in engineering; 8+ years semiconductor packaging design experience; strong Cadence Allegro APD+ skills; experience with interposer/substrate, 2.5D/3D packages, SI/PI and thermal analysis tools.
Cadence Allegro Package Designer Plus (APD+), Celsius PowerDC, Sigrity Advanced SI II, Sigrity Advanced PI II, AWR, Momentum, HFSS
Lockheed MartinNYSE: LMT: Global security and aerospace driving innovative defense solutions.
Requires U.S. citizenship, Secret clearance or eligibility, Creo and Windchill knowledge, packaging and hardware design experience, GD&T, and tolerance stack-up analysis.
Lockheed MartinNYSE: LMT: Global security and aerospace driving innovative defense solutions.
U.S. citizenship, Secret clearance or ability to obtain one, CREO and Windchill knowledge, GD&T and tolerance stack-up analysis, packaging and hardware design experience.
Lockheed MartinNYSE: LMT: Global security and aerospace driving innovative defense solutions.
5+ YOEBachelor's degree in electrical, mechanical, or related STEM field and 5+ years of electromechanical engineering experience, or 10 years without a degree; CATIA, electronics packaging, leadership, and DoD clearance capability required.
Smurfit WestrockNYSE: SW: Global leader in sustainable paper and packaging solutions.
3+ YOEBachelor's degree in mechanical or related engineering and 3+ years designing automation or packaging machinery; requires 3D modeling, manufacturing, documentation, and technical communication skills.
3D CAD, Python, C#, VBA, JavaScript, REST APIs, SQL, version control systems
Celebration or Orlando or Polk County or Orange County
OnsiteFull Time
HDR: Global professional services firm specializing in architecture, engineering, and construction.
10+ YOEBachelor's degree, professional engineer (PE) license, minimum 10 years bridge design experience; proven technical leadership, bridge analysis/design expertise, review of DB team submittals, and familiarity with multiple bridge engineering software packages. Master's and SE preferred.
NV5 Global, Inc.NASDAQ: NVEE: Provider of engineering, testing, inspection, and consulting solutions.
7+ YOEFL PE license, B.S. in Civil/Structural Engineering (M.S. preferred), 7+ years structural design experience, proficiency with ETABS,RISA,RAM suite,Revit and Microsoft Excel; ability to assemble calculation packages.
Revit, ETABS, RISA, RAM Structural System, RAM Elements, RAM Concept, Enercalc, Microsoft Excel, SteelSmart, Simpson CFS Designer, Building Information Modeling (BIM)
Lockheed MartinNYSE: LMT: Global security and aerospace driving innovative defense solutions.
3+ YOEBachelor's degree in electrical, mechanical, or related STEM engineering; 3+ years of electromechanical experience; CREO, Windchill, CAD/PLM, GD&T, packaging design, BOM, drawings, and 3D modeling experience; U.S. citizenship and ability to obtain Secret clearance.
Zuken, Windchill, CREO, Microsoft Excel, Microsoft Word, Microsoft PowerPoint, AutoCAD, Windchill PDM
AECOMNYSE: ACM: Global infrastructure consulting and professional services firm.
2+ YOEBS in engineering (or equivalent) with 2+ years (junior) to 10+ years (senior) related experience; EIT or PE preferred; experience producing roadway lighting design packages and using AGi32, MicroStation and OpenRoads; DOT experience preferred.
Kimley-Horn: Full-service engineering, planning, and environmental consulting firm.
4+ YOE4+ years of substation design experience; proficiency with AutoCAD, MicroStation, Inventor; experience with grounding, lightning, and lighting studies; able to lead technical work and produce construction drawing packages.
Blue Origin: Developing reusable space vehicles and infrastructure.
3+ YOEA.S. in drafting/design or equivalent, 3+ years electronics packaging experience for aerospace avionics LRUs/sensor enclosures, proficient with PTC Creo View and Windchill, GD&T and ASME drafting standards, familiarity with IPC/WHMA-A-620 or NASA-STD-8739.4, U.S. work-authorization required.