40 packaging design engineer jobs at 17 companies in Pacific Grove, CA
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Packaging Design Engineer
San Jose or San Diego
HybridFull Time
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Managing R&D, selection, and implementation of manufacturing processes for consumer packaging parts and assemblies; strong product and process engineering skills.
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
5+ YOEBachelor's degree in electrical or computer engineering and 5+ years of digital design experience, including a full chip from specification to tapeout. Requires Verilog/SystemVerilog, RTL, synthesis, timing closure, CDC, lint, and low-power expertise.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's (5+ years) or Master’s (3+ years) in Electrical Engineering or related field; experience in package/PCB/high-speed design, power delivery, and EDA tools; scripting (Python, Perl, TCL, shell) and strong collaboration skills.
Etched: Private semiconductor startup building AI inference chips, racks, and software for frontier-model customers.
8+ YOEBachelor's or Master's in Electrical/Computer Engineering; 8+ years SI/PI experience on high-performance ASIC/accelerator platforms; PDN design, high-speed interfaces; proficiency with SI/PI tools; packaging/OSAT/ODM collaboration.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yrOnsiteFull Time
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
Efficient Computer: Developing ultra-low-power general-purpose processors for edge AI computing.
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
NetflixNASDAQ: NFLX: Provider of global streaming entertainment and video content.
10+ YOE10+ years software development experience (5+ years on inventory management); expertise in yield optimization, dynamic pricing, auction mechanics, rate card and packaging systems; API and data model design; technical leadership and strong communication.
Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yrHybridFull Time
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
Signal and Power Integrity Senior Application Engineer
San Jose, California, United States
$84k-$156k/yrOnsiteFull Time
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
1+ YOEBachelor's or Master's in Electrical/Electronics Engineering, 1+ years related experience, strong background in signal, power, and electromagnetics for package and PCB design, excellent communication and presentation skills.
Signal Integrity & Power Integrity Principal Engineer
San Jose, California, United States
$187k-$270k/yrOnsiteFull Time
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
15+ YOE15+ years SI/PI experience; Bachelor's in Electrical/Computer Engineering; expertise in SI/PI for silicon/package/board; strong with HFSS/HSPICE/Sigrity/ADS; scripting in Python/MATLAB; design tool experience
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
7+ YOE10+ years PI experience with bachelor’s (or 7+ with advanced degree); deep power integrity expertise for 2.5D/3D packaging, PDN design, transient/EM/IR analysis, simulation tool proficiency, and cross-functional leadership.