40 packaging design engineer jobs at 17 companies in Pacific Grove, CA

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Packaging Design Engineer
San Jose or San Diego
HybridFull Time
AMD
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
Cadence, SKILL, Ansys, AutoCAD
3mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
2mo
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Manufacturing Design Engineer (MDE) - Packaging
Cupertino, California, United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Managing R&D, selection, and implementation of manufacturing processes for consumer packaging parts and assemblies; strong product and process engineering skills.
1w
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Packaging Tech Lead Design Engineer
San Jose, California, United States
$185k-$240k/yr OnsiteFull Time
Astera Labs
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
5+ YOEBachelor's degree in electrical or computer engineering and 5+ years of digital design experience, including a full chip from specification to tapeout. Requires Verilog/SystemVerilog, RTL, synthesis, timing closure, CDC, lint, and low-power expertise.
Verilog, SystemVerilog, RTL, CDC, DFT, BIST, PCIe, CXL, Ethernet, NVLink, UALink, UCIe, COSMOS, SoC
2mo
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Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
Analog Devices
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
2w
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
4w
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
Broadcom
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
1mo
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IC Package Design Engineer
San Jose, California, United States
$153k-$219k/yr HybridFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's (5+ years) or Master’s (3+ years) in Electrical Engineering or related field; experience in package/PCB/high-speed design, power delivery, and EDA tools; scripting (Python, Perl, TCL, shell) and strong collaboration skills.
EDA, Python, Perl, TCL, Shell
3mo
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Advanced Packaging SI/PI Engineer
San Jose, California, United States
$150k-$275k/yr OnsiteFull Time
Etched
Etched: Private semiconductor startup building AI inference chips, racks, and software for frontier-model customers.
8+ YOEBachelor's or Master's in Electrical/Computer Engineering; 8+ years SI/PI experience on high-performance ASIC/accelerator platforms; PDN design, high-speed interfaces; proficiency with SI/PI tools; packaging/OSAT/ODM collaboration.
ANSYS HFSS, SIwave, Cadence Sigrity, Keysight ADS
1mo
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Principal Package Design Engineer
San Jose, California, United States
$195k-$240k/yr HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Cadence Allegro Package Designer, Solid works, ANSYS, COMSOL, JMP, Minitab
2mo
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Mechanical Design Engineer
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yr OnsiteFull Time
MACOM
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
SolidWorks, Icepak, AutoCAD, PCB layout viewers, GD&T
3w
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Physical Design - SOC Top Lead
San Jose or Pittsburgh or Austin
$200k-$250k/yr OnsiteFull Time
Efficient Computer
Efficient Computer: Developing ultra-low-power general-purpose processors for edge AI computing.
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
Innovus, ICC2, Tempus, PrimeTime, RedHawk, Calibre, Voltus, TCL, shell, python
3mo
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Software Engineer 6 - Ads Pricing & Packaging
Los Gatos or New York
$499k-$900k/yr OnsiteFull Time
Netflix
NetflixNASDAQ: NFLX: Provider of global streaming entertainment and video content.
10+ YOE10+ years software development experience (5+ years on inventory management); expertise in yield optimization, dynamic pricing, auction mechanics, rate card and packaging systems; API and data model design; technical leadership and strong communication.
VAST, OpenRTB
3mo
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SPE Signal Integrity Engineer
Johns Creek or San Jose or Bangalore or Seoul
$134k-$249k/yr OnsiteFull Time
Rambus
RambusNASDAQ: RMBS: Develops high-performance memory interface chips and semiconductor IP.
10+ YOESenior-level SI/PI engineer with 10+ years in DDR4/5, EM theory, and package design.
ADS, HFSS, Q3D/PowerSI, Spice
2mo
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Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yr HybridFull Time
Gusto
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
1mo
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Signal and Power Integrity Senior Application Engineer
San Jose, California, United States
$84k-$156k/yr OnsiteFull Time
Cadence Design Systems
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
1+ YOEBachelor's or Master's in Electrical/Electronics Engineering, 1+ years related experience, strong background in signal, power, and electromagnetics for package and PCB design, excellent communication and presentation skills.
Sigrity, Clarity, PCB Editor, ICP, Cadence Allegro
3mo
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Signal Integrity & Power Integrity Principal Engineer
San Jose, California, United States
$187k-$270k/yr OnsiteFull Time
Altera
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
15+ YOE15+ years SI/PI experience; Bachelor's in Electrical/Computer Engineering; expertise in SI/PI for silicon/package/board; strong with HFSS/HSPICE/Sigrity/ADS; scripting in Python/MATLAB; design tool experience
ANSYS HFSS, Synopsys HSPICE, Cadence Sigrity, Keysight ADS, Mentor Graphics, Cadence Allegro, Python, MATLAB
2mo
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Power Integrity Engineer-Silicon
San Jose, California, United States
OnsiteFull Time
Lumilens
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
7+ YOE10+ years PI experience with bachelor’s (or 7+ with advanced degree); deep power integrity expertise for 2.5D/3D packaging, PDN design, transient/EM/IR analysis, simulation tool proficiency, and cross-functional leadership.
Ansys SIwave, HFSS, Cadence Sigrity, Apache RedHawk, Voltus, Keysight ADS