25 packaging design engineer jobs at 16 companies in Parker, CO
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Principal Engineer - Packaging Equipment
Omaha or Chicago or Denver
$109k-$159k/yr RemoteFull Time
7+ YOEBachelor's in Mechanical/Robotics/Packaging Engineering,7+ years food manufacturing packaging design,automation and project engineering experience,USDA/FDA-regulated environment experience,team leadership,automation/robotics expertise.
2mo
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Experienced Water / Wastewater Design Engineer
Lakewood, Colorado, United States
$93k-$139k/yr HybridFull Time
5+ YOEBachelor's in civil, chemical, or environmental engineering required; 5+ years water/wastewater design experience; ability to prepare design packages and P&IDs, perform hydraulic analyses and equipment sizing; valid U.S. driver's license; PE preferred.
3mo
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Engineering Design Package Electrical Engineer
Longmont or Greenville or Roanoke or Schenectady
$90k-$120k/yr OnsiteFull Time
3+ YOEBachelor’s in Electrical Engineering; 3+ years in installation packages/field engineering in power/industrial settings; travel ~15%; strong communication and customer interaction.
Electrical drawings, Cable schedules, Power bus routing, Equipment arrangements, Specifications generation, Field engineering, Interconnection drawings, Turbine control products, GE Excitation
1w
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Principal Mechanical Design Engineer, Antenna
Denver, Colorado, United States
$148k-$193k/yr OnsiteFull Time
12+ YOEBachelor’s or master’s degree in mechanical engineering or related field, or BSEE with 12+ years’ experience; proficiency in SolidWorks/Creo and ANSYS/FloTHERM; RF packaging and manufacturing collaboration experience.
SolidWorks, Creo, ANSYS, FloTHERM, 3-D CAD, FEA, CFD, SMT
1mo
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Ground System Design Engineer III
Florida or Seattle or Denver
$111k-$169k/yr OnsiteFull Time
7+ YOEB.S. in engineering with ≥7 years experience in development and packaging of aircraft/spacecraft/launch structures, configuration control, 3-D CAD skills, scheduling knowledge, strong communication; ability to obtain security clearance.
PTC Creo, DOORS, Windchill, 3-D CAD
4mo
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R&D Hardware Engineer
Colorado Springs, Colorado, United States
$115k-$192k/yr OnsiteFull Time
7+ YOEBS or MS in Electrical Engineering; 7+ years hardware/circuit design, RF/microwave, high-frequency modeling; semiconductor, packaging, PCB; EE/RF theory knowledge; materials science; IC design familiarity.
RF, Microwave, PCB, Semiconductor, Packaging, IC design, Thermal analysis, Thermodynamics
4mo
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R&D Package Design and Signal Integrity
Colorado Springs, Colorado, United States
$115k-$192k/yr OnsiteFull Time
7+ YOEBS/MS in Electrical Engineering, 7+ years hardware/circuit/RF design or related experience (MS+5yrs acceptable). Requires expertise in signal integrity, RF/high-frequency design, packaging, materials, and thermostructural analysis.
2mo
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
2mo
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Electrical Engineer 3
Lakewood, Colorado, United States
$104k-$140k/yr OnsiteFull Time
5+ YOEBachelor's in science or equivalent, Professional Engineer (PE) license required, 5+ years engineering experience on multidiscipline project teams, valid driver's license, strong communication, QA/QC, and design package development skills.
5d
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Senior Engineer, High Voltage Development
Louisville, Colorado, United States
$156k-$160k/yr HybridFull Time
6+ YOEBachelor's degree in Electrical Engineering or related field and 6 years of high-voltage design experience. Requires substation, generation tie, utility coordination, EPC bid, due diligence, design-package management, and estimating experience.
AutoCAD, Bluebeam, ETAP, OpenDSS, Google Earth, Microsoft Suite, IEEE, NESC, NFPA, ISO, NERC, CAISO, HECO, Xcel, Tri State, PacifiCorp
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Engineer 4-EN4
Greenwood Village, Colorado, United States
$129k-$146k/yr OnsiteFull Time
5+ YOEABET-accredited Bachelor's in Engineering, PE license required, 5+ years transmission line experience, proficiency with PLSCADD/PLSPOLE/PLS TOWER and MS Office, ability to lead drafting teams, produce design packages, estimates, and perform field visits.
PLSCADD, PLSPOLE, PLS TOWER, Microsoft Office
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Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yr HybridFull Time
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
2mo
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Principal Mechanical Engineer I
Westminster, Colorado, United States
$134k-$161k/yr OnsiteFull Time
9+ YOEBS or MS in Mechanical/Aerospace Engineering, 9+ years in electronics packaging design (thermal, vibration, stress), expertise in thermal management, FEA/thermal simulation (Ansys), SolidWorks CAD, GD&T, EMI/EMC mitigation, spaceflight hardware experience, and strong communication skills. US person required.
Ansys, SolidWorks
3w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience, advanced IC package or interposer layout expertise, package design tools, scripting, Windows/Linux, and customer-facing applications engineering skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens Xpedition/i3DL, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Siemens Calibre DRC, Siemens Calibre LVS, 3DSTACK, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
3d
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2027 Masters ASIC Package Engineering Co-op/Intern
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
$80k-$120k/yr HybridInternship, Contract
Currently enrolled in a U.S. master's program in engineering or related field; knowledge of circuits, package/PCB design software, Perl, Python, SQL, semiconductor packaging, or data analytics preferred.
Perl, Python, SQL, Power BI
3w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
2mo
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Transmission Line Engineers
Mechanicsburg or Dallas or United States or Denver or Salt Lake City or Indianapolis or Cincinnati or Charlotte or Roanoke or Marlton or Pittsburgh or St. Louis or Chicago or Phoenix
$90k-$125k/yr RemoteFull Time
3+ YOEBachelor's in civil/electrical/structural engineering, 3+ years transmission line design, high proficiency in PLS-CADD, knowledge of NESC/IEEE codes, ability to prepare construction packages, travel to client sites; PE preferred.
PLS-CADD, RISA-3D, STAAD
2w
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Director - Data Centers (62981)
Lakewood, Colorado, United States
$130k-$180k/yr RemoteFull Time
10+ YOEBachelor's in engineering, 10+ years of relevant engineering or field experience, and 5+ years of business experience. Requires electrical data center expertise, design package management, Microsoft Office skills, and U.S. work authorization.
Microsoft Office, Microsoft Excel, Microsoft Word, Microsoft Project