15 packaging design engineer jobs at 9 companies in Santa Paula, CA
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Packaging Engineer - Dolls
El Segundo, California, United States
$84k-$106k/yr OnsiteFull Time
1+ YOEBachelor's degree and 1–3 years of packaging or industrial design experience preferred. Requires Artios CAD, 3-D modeling, packaging manufacturing knowledge, engineering drawings, creativity, communication, organization, and project coordination.
Artios CAD, SolidWorks
1mo
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Sr Packaging Engineer - Games
El Segundo, California, United States
$100k-$125k/yr OnsiteFull Time
3+ YOE3-5 years packaging or industrial design experience preferred, bachelor\u0002s degree in packaging engineering or related field preferred, proficiency in Artios CAD and SolidWorks, strong project management and communication skills.
Artios CAD, Solidworks
3w
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Senior Mechanical Design Engineer
Santa Clarita, California, United States
$95k-$126k/yr OnsiteFull Time
7+ YOEBachelor's degree in aerospace or mechanical engineering and 7+ years in aerospace, defense, or regulated industry. Requires electronics packaging, mechanical design, analysis, customer requirements, and PDM/PLM experience.
MCAD, SolidWorks, ECAD, Altium, PDM, PLM, 3D Printing, BOMs, ASME Y14.100, ASME Y14.5, ASME Y14.24
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Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design)
El Segundo, California, United States
$146k-$198k/yr OnsiteFull Time
9+ YOEBachelor’s in engineering or related field; 9+ years CAD/design experience; thermal/structural analysis or PCB design experience; ability to obtain US Secret clearance.
Creo CAD, SolidWorks, ANSYS, Siemens NX Nastran, MSC Patran, COMSOL Multiphysics, PCB design tools
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Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design)
El Segundo, California, United States
$146k-$198k/yr OnsiteFull Time
9+ YOEBachelor's in engineering or related field; 9+ years CAD/analyses experience; US citizenship and ability to obtain security clearance; experience with thermal/structural/dynamics/vibration or PCB design/assembly.
CAD (various), ANSYS, Creo, SolidWorks, FEA, Siemens NX, Nastran, MSC Patran, COMSOL Multiphysics, PCB design/assembly
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Optoelectronic Component Design Engineer
Camarillo, California, United States
$120k-$140k/yr OnsiteFull Time
6+ YOEBachelor's in EE/Applied Physics, 6+ years in optoelectronic component manufacturing/engineering, experience with microelectronic packaging/assembly, NPI, customer-facing technical work, product qualification/compliance, and ability to work with export-controlled information (U.S. Person).
AutoCAD, Microsoft Office Suite, ERP Systems, SPC, DOE, JMP, Minitab, multimeter, picoamp meters, power supplies, optical microscopes, spectrometers, wire bonders, die attach systems, environmental chambers, optical testers
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Electronics Products Digital and Power Product Design Engineering Senior Manager
El Segundo, California, United States
$182k-$246k/yr OnsiteFull Time
5+ YOE5+ MgmtBachelor's degree in a related field, active U.S. Top Secret clearance, and 5+ years each in EEE components and circuit assemblies, electronic packaging design, and engineering team leadership.
CREO, Teamcenter, Microsoft Project, Expedition
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Engineer, Manufacturing
Sylmar, California, United States
$101k-$120k/yr OnsiteFull Time
2+ YOEBachelor's in engineering, 2+ years manufacturing/design experience, CAD and analysis software familiarity, rapid prototyping and electronic packaging experience, LEAN experience, strong communication and project management skills, willingness to travel.
CAD, LEAN
3d
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Electronics Products Radio Frequency (RF) Product Design Engineering Senior Manager
El Segundo, California, United States
$182k-$246k/yr OnsiteFull Time
5+ YOE5+ MgmtRequires active U.S. Top Secret clearance, U.S. citizenship, bachelor's degree, and 5+ years each in EEE components, engineering team leadership, and electronic packaging design.
CREO, Teamcenter, Microsoft Project, Expedition
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Mechanical Engineer II
Simi Valley, California, United States
OnsiteFull Time
2+ YOEDesign and analyze mechanical packaging for RF microwave components; CAD: SolidWorks, AutoCAD; 2-5 years post-grad; US Person; BSME; strong communication.
SolidWorks, AutoCAD
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Senior Mechanical Engineer
Goleta, California, United States
$96k-$182k/yr OnsiteFull Time
5+ YOEU.S. citizen able to obtain/maintain DoD Secret clearance; STEM degree with 5+ years (or advanced degree with 3+ years); experience with GD&T and ASME standards, CREO, mechanical design, thermal/structural analysis and electronics packaging.
Geometric Dimensioning and Tolerancing (GD&T), ASME, CREO, Earned Value Management (EVM)
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Electronics Products Radio Frequency (RF) Product Design Engineering Senior Manager
El Segundo, California, United States
$182k-$246k/yr OnsiteFull Time
5+ YOE5+ MgmtBachelor's degree or equivalent, active U.S. Top Secret clearance, 5+ years in EEE components, circuit cards, printed wiring boards, electronic packaging, and engineering team leadership.
CREO, Teamcenter, Microsoft Project, Expedition
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R&D Engineer, Signal Integrity
Calabasas, California, United States
$150k-$250k/yr RemoteFull Time
7+ YOEBS/MS in Electrical Engineering, 7+ years experience in hardware/IC package design or high-frequency modeling, expertise in signal integrity, PCB and substrate technologies, and strong communication skills.
ANSYS HFSS, 3D-Layout, Polar Instruments, Allegro
2w
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Manager, Package Development & Engineering
El Segundo, California, United States
$90k-$100k/yr OnsiteFull Time
4+ YOEBachelor’s degree in packaging technology, engineering, or related field; 4–5 years of cosmetics or personal care packaging engineering experience; proficiency with packaging design, material science, sustainability, and statistical software.
3D CAD, Bill of Materials (BOM)
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Electronics Products Digital and Power Product Design Engineering Senior Manager
El Segundo, California, United States
$182k-$246k/yr OnsiteFull Time
5+ YOE5+ MgmtActive U.S. Top Secret clearance and U.S. citizenship required. Bachelor's degree in a related field plus 5+ years in EEE components, circuit card and printed wiring board requirements, electronic packaging, and engineering team leadership.
CREO, Teamcenter, Microsoft Project, Expedition, Earned Value Management System (EVMS)