7 packaging design engineer jobs at 4 companies in Stockton, CA
3mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
2mo
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Sr Principal Laser Packaging Engineer
Fremont, California, United States
$200k-$280k/yr OnsiteFull Time
10+ YOEPhD in a related field, 10+ years R&D experience in optoelectronic package design transferred to manufacturing, submicron optical alignment, FEA/thermal design, GR-468 qualification, NPI, and strong supplier/customer communication.
Finite Element Analysis (FEA), CFD
1mo
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Staff Mechanical Engineer
Fremont or Salem
$185k-$240k/yr HybridFull Time
8+ YOE8+ years mechanical design experience, B.S./M.S. in Mechanical Engineering, experience with mechanism design, electronics packaging, FEA/thermal analysis, Creo, Windchill, Jira/Confluence; ability to mentor engineers.
Creo, Windchill, Jira, Confluence
3w
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Optical Engineer (52249)
Milpitas, California, United States
$121k-$178k/yr OnsiteFull Time
2+ YOEMaster’s degree in optical or electrical engineering, applied physics, or equivalent experience; 2+ years in optics or related fields; optical testing, laser package design, modeling, simulation, and failure analysis experience.
Lumerical, Tidy3D, COMSOL, Claude, ChatGPT, TEM, EELS, EDS, SIMS, XPS, Microsoft Office
2mo
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Principal Mechanical Engineer - Optical Solutions - Fremont, California, United States
Fremont, California, United States
$180k-$250k/yr OnsiteFull Time
10+ YOEMaster's in Mechanical Engineering, 10+ years R&D experience designing fiber-coupled optoelectronic packages, FEA/thermal analysis, submicron optical alignment, NPI experience, supplier/customer communication.
FEA
3w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
2mo
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Principal Laser Component Engineer - Optical Solutions - Fremont, California, United States
Fremont, California, United States
$150k-$250k/yr OnsiteFull Time
8+ YOEMaster's in photonics/ME/physics/optics, 8+ years R&D experience with optical/mechanical components for optoelectronic packages, hands-on alignment and high-precision design, GR-468 qualification knowledge, supplier and cross-functional collaboration skills.
GR-468 Telcordia, New Product Introduction (NPI)