10 packaging design engineer jobs at 8 companies in Temecula, CA
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Packaging Engineer, Sentry
Irvine, California, United States
$129k-$171k/yrOnsiteFull Time
Anduril Industries: Defense technology building autonomous military hardware and software.
5+ YOEBachelor's degree in a technical field, 5+ years packaging engineering experience for electronic/electromechanical products, ability to design and validate protective packaging, knowledge of ASTM/ISTA/MIL-STD, CAD proficiency (SolidWorks/NX), must be a U.S. Person.
SolidWorks, NX, Siemens NX, JIRA, Teamcenter, Oracle, PDM/PLM, MES
Entry Level Packaging Systems Design Engineer I (Start Summer 2027)
Carlsbad, California, United States
$78k-$82k/yrFieldFull Time
Dennis Group: A design-build engineering firm and general contractor specializing in food and beverage processing facilities.
0+ YOEBachelor’s degree in mechanical, packaging, industrial, or manufacturing engineering; 0–3 years’ experience or schooling; proficiency with MS Office, MS Project, and AutoCAD; strong communication and problem-solving skills.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027)
Carlsbad, California, United States
$78k-$82k/yrFieldFull Time
Dennis Group: A design-build engineering firm and general contractor that plans, designs, engineers, and builds food and beverage processing facilities.
0+ YOEBachelor’s degree in mechanical, packaging, industrial, or manufacturing engineering; 0–3 years of experience or schooling; MS Office, MS Project, and AutoCAD proficiency; strong communication and problem-solving skills.
5+ YOEBS in engineering design, 5+ years mechanical design experience, proficiency with CAD tools, knowledge of geometric tolerances and packaging, strong communication skills, ITAR-eligible.
AutoCAD, Mechanical Desktop, Inventor, Pro Engineer, SolidWorks
ViasatNASDAQ: VSAT: Provider of global satellite-based connectivity and secure communication solutions.
5+ YOE5+ years mechanical design experience with electronics packaging, SolidWorks, thermal analysis to junction level, ruggedized product design, BS in Mechanical Engineering, U.S. citizenship, ability to obtain U.S. Secret Clearance.
SolidWorks, Ansys, Thermal Desktop, SolidWorks Flow Sim, Microsoft Word, Microsoft Excel, Microsoft PowerPoint
ViasatNASDAQ: VSAT: Provides global satellite broadband and secure networking communication services.
5+ YOE5+ years mechanical design experience with electronics packaging, SolidWorks, thermal analysis (Ansys/Thermal Desktop/SolidWorks Flow Sim), optics integration, bachelor in mechanical engineering, U.S. citizenship and ability to obtain U.S. Secret clearance.
SolidWorks, Ansys, Thermal Desktop, SolidWorks Flow Sim, Microsoft Word, Microsoft Excel, Microsoft PowerPoint
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
StrykerNYSE: SYK: Manufactures medical devices and equipment for healthcare providers.
2+ YOEBachelor's degree in engineering and 2+ years of manufacturing experience. Requires validation experience, issue troubleshooting, equipment and tooling design, engineering drawing interpretation, and analytical problem-solving skills.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Owning and driving package substrate design, technology, manufacturing, and reliability; cross-functional collaboration to optimize package performance and roadmap.