15 packaging designer jobs at 13 companies in Dover, NH
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Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
10+ YOEAssociate's degree in mechanical CAD design or related plus 10+ years related experience; ability to obtain Secret clearance; electro-mechanical packaging experience; proficiency with PTC Creo Parametric and Windchill; GD&T/ASME knowledge.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
2+ YOEMaster’s or PhD in electrical, mechanical, or materials science engineering; 2+ years in semiconductor packaging development or manufacturing; package design, simulation, materials, assembly, and reliability expertise.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
BAE SystemsLondon Stock Exchange: BA.: Produces advanced defense, aerospace, and information security systems.
Bachelor's degree in engineering, broad military electronics packaging design experience, organizational leadership, strong PCB design background, communication skills, and ability to obtain Secret clearance.
Infineon TechnologiesFrankfurt Stock Exchange: IFX: Designs and manufactures semiconductors for power and IoT systems.
6+ YOETechnical degree in physics or electronics preferred, 6+ years experience in assembly/Back End technologies, SMT knowledge, experience with package design tools (AutoCAD, Cadence), strong communication and presentation skills.
Hannaford SupermarketsEuronext Amsterdam: AD: Operates a chain of supermarkets selling food and groceries.
Customer service and communication skills, willingness to learn multiple tasks, ability to shop and package customer orders, use designated equipment, and lift or push products safely.
San Diego or District of Columbia or Jacksonville or Honolulu or Pearl Harbor or Kittery or Norfolk or Silverdale
$106k-$158k/yrOnsiteFull Time
Department of the Navy: Operates and maintains combat-ready naval and marine forces.
1+ YOEProfessional engineering degree or EI/EIT/PE, 1+ year specialized experience at GS-12 level producing electrical design packages, reviewing submittals, and providing construction consultation; security clearance and financial disclosure required.
Senior Principal Mechanical Engineer Advanced Technologies Product Lead
Marlborough or Tewksbury or Portsmouth or Andover
$132k-$252k/yrOnsiteFull Time
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
10+ YOEU.S. citizen with active transferable Top Secret DoD clearance; STEM degree with typically 10+ years relevant experience; mechanical design and prototype build experience; electronic packaging and IRAD background; strong communication and project skills.
CREO(Pro/E), ANSYS Mechanical, Microsoft Word, Microsoft Excel, Microsoft PowerPoint
Mercury SystemsNASDAQ: MRCY: Provides secure processing solutions for aerospace and defense missions.
4+ YOEBachelor's in electrical/electronics engineering, 4+ years HDI package/layout experience, proficiency with Cadence APD+ and Constraint Manager, CAM350/Blueprint, knowledge of HDI/flip‑chip/interposer designs and JEDEC/IPC standards; must have or obtain U.S. government security clearance.
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yrOnsiteFull Time
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.