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Designer
Nampa, Idaho, United States
$63k-$95k/yr OnsiteFull Time
Design packaging and POP displays, evaluate customer needs, develop prototypes, recommend materials and production methods, and provide technical support to sales and manufacturing.
Microsoft Word, Microsoft Excel, Microsoft Outlook, Computer Assisted Design (CAD)
3w
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Packaging & Material Handling System Designer
Meridian or Plover or Madison or Minneapolis
$24-$35/hr OnsiteFull Time
3+ YOEHigh school diploma, 3+ years packaging/material handling or industrial facilities design experience, AutoCAD and Inventor experience, ability to work with scan/point cloud data, strong communication, willingness to travel 10–30%.
AutoCAD, Inventor
3mo
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Senior Packaging & Material Handling Systems Designer
Meridian or Madison or Plover or Minneapolis
$35-$51/hr OnsiteFull Time
9+ YOEHigh school diploma; 9+ years packaging systems/material handling/industrial facilities design; AutoCAD proficiency; strong client communication; willing to travel 10–30%.
AutoCAD, Inventor, 3D modeling
3mo
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Package Architect – Advanced Packaging & System Exploration
Boise or San Jose
$177k-$387k/yr OnsiteFull Time
10+ YOEBachelor's in EE/ME/Materials or equivalent, 10+ years in package design or package-level simulation, strong package SI modeling and analysis experience, ability to build models and derive architecture guidance.
3mo
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Package Architect – Advanced Packaging & System Exploration
Boise or San Jose
$177k-$387k/yr OnsiteFull Time
10+ YOEBachelor’s degree or equivalent practical experience; 10+ years in package design or package-level simulation; strong SI modeling/analysis; ability to build models and drive conclusions.
SI modeling, Thermal simulation, Package design, Modeling tools
1mo
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Senior Package Design Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEMaster's +5 years or Bachelor's +10 years in EE/ME/Materials; proficiency with Cadence Allegro Package Designer+, Integrity 3D-IC Platform, Siemens/MentorGraphics Xpedition; experience in advanced memory substrate and package design, SI/PI collaboration, OSAT/HVM.
Cadence Allegro Package Designer+, Integrity 3D-IC Platform, Siemens/MentorGraphics Xpedition tool suite, AutoCAD (Autodesk Mechanical)
1mo
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Senior Package Design Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEBachelor’s in Electrical Engineering or Materials Science; 5+ years in semiconductor package/design; experience with layout tools and cross-functional teams; strong understanding of electrical, thermal, mechanical behavior in packaging.
package design tools, parasitic modeling tools, signal integrity tools, thermal analysis tools, floorplanning and routing tools
2mo
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Sr. Product Development Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEMaster's in relevant engineering/physics field plus 5 years experience or equivalent. Deep knowledge of DRAM/NAND device structures, chip-package-interaction (CPI), wafer probe/test flows, BEOL fabrication, package design/assembly, and reliability qualification methods.
3mo
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SMTS Product Architect
Boise or Folsom or San Jose
$177k-$387k/yr OnsiteFull Time
12+ YOEBachelor's in Electrical Engineering, 12+ years engineering experience, familiarity with LPDDR/DRAM/module architectures, memory hierarchy and SoC/ASIC design, experience with TSV/stacked/3D packaging; mentoring experience preferred.
3w
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Civil Design Tech III
Boise, Idaho, United States
$44-$67/hr OnsiteFull Time
10+ YOE10+ years Civil CAD and 3D modeling experience; advanced Autodesk Civil 3D expertise; proficiency with Revit, Inventor, ReCap, Navisworks, Autodesk Construction Cloud, and Bluebeam Revu; GIS/survey/point-cloud integration; ability to produce drawing packages and lead QA/QC.
Autodesk Civil 3D, Revit, Inventor, ReCap, Navisworks, Autodesk Construction Cloud (ACC), Bluebeam Revu, GIS