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Sr. Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Adobe Creative Suite, Illustrator, Photoshop, InDesign, CAD
2w
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Principal Packaging and Graphic Designer
Austin, Texas, United States
$144k-$198k/yr OnsiteFull Time
9+ YOE9+ years design experience in consumer electronics or lifestyle products; strong packaging portfolio; advanced Adobe Creative Suite skills; 3D visualization with KeyShot/Blender/Cinema 4D/Maya; experience with AI-assisted creative tools; bachelor’s degree preferred.
Illustrator, Photoshop, InDesign, After Effects, Premiere, KeyShot, Blender, Cinema 4D, Maya
2w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
3w
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AI Automation Design Packaging Lead
Austin, Texas, United States
$163k-$244k/yr HybridFull Time
Technical leader to develop and deploy AI-driven packaging design automation. Requires bachelor's or master's in EE/CE/CS, experience with EDA tools, scripting (Python/Tcl/SKILL/C++), AI/ML frameworks, and cross-functional leadership.
Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler, Python, Tcl, SKILL, C++, PyTorch, TensorFlow
1mo
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Senior Manager, Pricing & Packaging
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yr HybridFull Time
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
Microsoft Excel, Microsoft PowerPoint
2d
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Design and execute structural packaging for consumer products, ensure product protection and sustainability, and collaborate with cross-functional teams during design processes.
1w
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Electric Utility Field Designer
Austin, Texas, United States
FieldFull Time
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
4w
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
1mo
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Staff Package Design Engineer
Austin or Tempe
HybridFull Time
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Cadence Allegro Package Designer, Siemens Xpedition Substrate Integrator
3d
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
1w
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
2mo
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Design & Verification Engineer, Analog Power Management (7682)
Austin, Texas, United States
$120k-$170k/yr OnsiteMultiple Commitments Available
7+ YOEMSEE with 7+ years in power management design/verification; SIMPLIS experience; PCB design/layout for power; IC design/packaging; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
2mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
2mo
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Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yr OnsiteFull Time
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
1mo
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Mechanical Engineer, Staff to Principal level
Austin, Texas, United States
$110k-$183k/yr OnsiteFull Time
8+ YOEExperienced mechanical design engineer for high-power electrical equipment; strong busbar, wire-harness, board-packaging, insulation coordination, manufacturability, FEA/CFD, and SolidWorks skills; mentoring experience.
SolidWorks, FEA, CFD, CNC
1mo
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Sr. Engineer, Package Design
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yr HybridFull Time
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Cadence Allegro PCB Designer
2w
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Hardware Engineering Lead
Endicott or Austin
$121k-$205k/yr OnsiteFull Time
8+ YOEBachelor's degree with 8+ years or 15+ years related experience; expertise in electronics packaging, CCA/PWB mechanical design, environmental test planning, DFM, drawing/configuration control; U.S. person required.
2mo
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Future Opportunities
Austin, Texas, United States
OnsiteFull Time
Open roles across content, production, marketing, design, operations, engineering; in-office East Austin; relocation package; unlimited PTO; health, dental, vision; 401(k) with company match; lunch stipend; team events; pet-friendly.
2w
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Mechanical Lead, R&D
Austin or New York City or San Francisco or Seattle
$284k-$340k/yr OnsiteFull Time
Proven mechanical design leadership for data centers or heavy industrial systems, experience releasing buildable mechanical packages, checking calculations, qualifying major equipment with vendors, and hiring/mentoring engineers; PE license and liquid-cooling experience preferred.
4d
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Senior IC Package Design Engineer - TeraWave
San Diego or Austin or California
$230k-$323k/yr OnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
7+ YOEBachelor's in EE or related,7+ years industry experience delivering IC packaging,expertise with HFSS/EMX/Momentum,Cadence Allegro experience preferred,RF/mmWave and power/signal integrity expertise,U.S. work authorization required.
HFSS, EMX, Momentum, Cadence Allegro
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