3+ YOEB.S. in Packaging or related engineering, 3+ years pharmaceutical/regulatory engineering experience, knowledge of secondary/tertiary packaging design and qualification, ASTM/ISTA/IATA standards, ArtiosCAD, Solidworks, TOPS, cGMP change control, and project management skills.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Premier Press: Creative production providing printing and branded merchandise.
7+ YOE7+ years creative experience with leadership, strong portfolio in packaging and production, expertise in creative operations, knowledge of structural packaging and print production, Adobe Creative Cloud proficiency, Mac/Windows experience, and excellent communication skills.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
6+ YOEBachelor's or higher in engineering, Materials Science, Chemistry, Physics, or related field with 6+ years experience; or Master's with 4+ years; or PhD with 4+ years; packaging engineering and thermal/mechanical/electrical design experience; qualification testing and packaging material certification.