2mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
4w
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Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
2mo
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Photonic Packaging Engineer, Principal
San Jose, California, United States
OnsiteFull Time
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
3mo
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Advanced Optical Packaging Design Tech Lead
San Jose, California, United States
$211k-$356k/yr OnsiteFull Time
7+ YOEMaster's/PhD in engineering or related field with 7+ years in semiconductor/optoelectronic packaging, expertise in substrate design, hybrid bonding, warpage analysis, signal integrity, and cross-functional production enablement.
Cadence APD/Allegro, ANSYS, HFSS, CST, KLayout, COMSOL
3mo
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Package Architect – Advanced Packaging & System Exploration
Boise or San Jose
$177k-$387k/yr OnsiteFull Time
10+ YOEBachelor's in EE/ME/Materials or equivalent, 10+ years in package design or package-level simulation, strong package SI modeling and analysis experience, ability to build models and derive architecture guidance.
3mo
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Package Architect – Advanced Packaging & System Exploration
Boise or San Jose
$177k-$387k/yr OnsiteFull Time
10+ YOEBachelor’s degree or equivalent practical experience; 10+ years in package design or package-level simulation; strong SI modeling/analysis; ability to build models and drive conclusions.
SI modeling, Thermal simulation, Package design, Modeling tools
1mo
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
3w
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Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yr HybridFull Time
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
3w
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Senior Package Design Engineer
San Jose or Taipei
$111k-$206k/yr HybridFull Time
5+ YOEMS in EE/CE, 5+ years packaging design/layout experience, proficiency with Cadence Allegro Package Designer (APD) and AutoCAD, experience with multiple package types and high-speed routing, knowledge of substrate technologies and JEDEC standards.
Cadence Allegro Package Designer (APD), AutoCAD
1w
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ASIC Package Design Manager
San Jose, California, United States
$144k-$230k/yr OnsiteFull Time
12+ YOE3+ MgmtManage and develop engineers for flip-chip-BGA package designs; requires 12+ years package design experience, 3+ years management, Ohio? (not stated), knowledge of SI/PI, project management and cross-functional collaboration.
1mo
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Principal Package Design Engineer
San Jose, California, United States
$200k-$250k/yr HybridFull Time
5+ YOEMSc or PhD in engineering, 5+ years in semiconductor/advanced packaging, expertise in package architectures, reliability testing, thermal/mechanical/electrical interactions, OSAT collaboration, simulations, and NPI to production.
Cadence Allegro Package Designer, SolidWorks, ANSYS, COMSOL, JMP, Minitab
2mo
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Senior Technical Program Manager (Silicon)
San Jose, California, United States
OnsiteFull Time
10+ YOE10+ years in silicon design/tapeout, packaging, bring-up, validation; BS in EE/CE; strong PM skills.
MS Project, Jira, Asana, Smartsheet
2mo
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PMIC Architect
San Jose or United States
$175k-$350k/yr HybridFull Time
15+ YOE5+ Mgmt15+ years in power IC architecture with principal-level experience; deep expertise in multi-phase buck converter design, mixed-signal IC design, integrated passive components, packaging, tape-out execution, and SPICE-level simulation.
SPICE, PMBus, I2C
1w
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Signal and Power Integrity Senior Application Engineer
San Jose, California, United States
$84k-$156k/yr OnsiteFull Time
1+ YOEBachelor's or Master's in Electrical/Electronics Engineering, 1+ years related experience, strong background in signal, power, and electromagnetics for package and PCB design, excellent communication and presentation skills.
Sigrity, Clarity, PCB Editor, ICP, Cadence Allegro
2mo
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Control Systems Services Manager
Walnut Creek or Modesto
$120k-$150k/yr OnsiteFull Time
5+ YOE5+ years troubleshooting automated control systems (PLC & HMI); Rockwell PLC/HMI/SCADA experience; Ignition SCADA; electrical design packages; strong communication; field service leadership.
Rockwell PLC, Rockwell HMI, Ignition SCADA, Ethernet, ControlNet, DeviceNet, P&ID, Electrical drawings
2mo
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Signal Integrity & Power Integrity Principal Engineer
San Jose, California, United States
$187k-$270k/yr OnsiteFull Time
15+ YOE15+ years SI/PI experience; Bachelor's in Electrical/Computer Engineering; expertise in SI/PI for silicon/package/board; strong with HFSS/HSPICE/Sigrity/ADS; scripting in Python/MATLAB; design tool experience
ANSYS HFSS, Synopsys HSPICE, Cadence Sigrity, Keysight ADS, Mentor Graphics, Cadence Allegro, Python, MATLAB
1mo
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Mechanical Design Engineer
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yr OnsiteFull Time
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
SolidWorks, Icepak, AutoCAD, PCB layout viewers, GD&T
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