36 packaging designer jobs at 18 companies in Leander, TX

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Sr. Packaging Designer
Austin, Texas, United States
HybridFull Time
Nutrabolt
Nutrabolt: Produces performance sports nutrition products and energy drinks.
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Adobe Creative Suite, Illustrator, Photoshop, InDesign, CAD
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Packaging and Graphic Designer 2
Austin, Texas, United States
$102k-$132k/yr OnsiteFull Time
Dell Technologies
Dell TechnologiesNYSE: DELL: Provides information technology hardware, software, and services.
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
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Packaging Designer, Amazon & Whole Foods Market Private Brands, Brand and Sustainability
Austin, Texas, United States
$79k-$138k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOE5+ years professional experience with packaging and brand systems; strong portfolio in food/CPG preferred; experience with data-driven improvements, cross-functional collaboration, art directing photography, and Adobe design tools.
Adobe Photoshop, Adobe Illustrator, Adobe InDesign
2w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
Microsoft
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
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AI Automation Design Packaging Lead
Austin, Texas, United States
$163k-$244k/yr HybridFull Time
AMD
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Technical leader to develop and deploy AI-driven packaging design automation. Requires bachelor's or master's in EE/CE/CS, experience with EDA tools, scripting (Python/Tcl/SKILL/C++), AI/ML frameworks, and cross-functional leadership.
Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler, Python, Tcl, SKILL, C++, PyTorch, TensorFlow
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Test Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Supporting design and execution of structural packaging, collaborating across functions to ensure product protection and sustainability; role emphasizes testing and cross-team coordination.
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Electric Utility Field Designer
Austin, Texas, United States
FieldFull Time
SEnergy
SEnergy: Provides electrical engineering and consulting for utility providers.
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
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Staff Package Design Engineer
Austin or Tempe
HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Cadence Allegro Package Designer, Siemens Xpedition Substrate Integrator
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
2mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
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Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yr OnsiteFull Time
TSMC
TSMCNew York Stock Exchange: TSM: Manufactures advanced semiconductor integrated circuits for global technology companies.
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
3mo
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Staff Mechanical Engineer – Upper Body Tech Lead
Austin, Texas, United States
OnsiteFull Time
Apptronik
Apptronik: Designs and manufactures humanoid robots for industrial automation.
8+ YOEBS or MS in Mechanical Engineering with 8+ years in mechanical design of complex robotic systems; strong leadership, cross-functional collaboration, and surfacing/packaging expertise.
CAD: SolidWorks, CAD: NX, CAD: Catia, NVIDIA Jetson
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Mechanical Engineer, Staff to Principal level
Austin, Texas, United States
$110k-$183k/yr OnsiteFull Time
Enphase Energy
Enphase EnergyNASDAQ: ENPH: Manufacturer of microinverter-based solar and energy storage systems.
8+ YOEExperienced mechanical design engineer for high-power electrical equipment; strong busbar, wire-harness, board-packaging, insulation coordination, manufacturability, FEA/CFD, and SolidWorks skills; mentoring experience.
SolidWorks, FEA, CFD, CNC
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Sr. Engineer, Package Design
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yr HybridFull Time
Tenstorrent
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Cadence Allegro PCB Designer
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Hardware Engineering Lead
Endicott or Austin
$121k-$205k/yr OnsiteFull Time
BAE Systems
BAE SystemsLondon Stock Exchange: BA.: Produces advanced defense, aerospace, and information security systems.
8+ YOEBachelor's degree with 8+ years or 15+ years related experience; expertise in electronics packaging, CCA/PWB mechanical design, environmental test planning, DFM, drawing/configuration control; U.S. person required.
2mo
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Future Opportunities
Austin, Texas, United States
OnsiteFull Time
Hammer Media
Hammer Media: Digital media producing financial education content on YouTube.
Open roles across content, production, marketing, design, operations, engineering; in-office East Austin; relocation package; unlimited PTO; health, dental, vision; 401(k) with company match; lunch stipend; team events; pet-friendly.
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Mechanical Lead, R&D
Austin or New York City or San Francisco or Seattle
$284k-$340k/yr OnsiteFull Time
Fluidstack
Fluidstack: Provides high-performance cloud GPU infrastructure for AI development.
Proven mechanical design leadership for data centers or heavy industrial systems, experience releasing buildable mechanical packages, checking calculations, qualifying major equipment with vendors, and hiring/mentoring engineers; PE license and liquid-cooling experience preferred.
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Package Consultant 3
Austin or Hartford or Indianapolis or Raleigh or Richardson or Tempe or United States
OnsiteFull Time
Infosys
InfosysNYSE: INFY: Provides IT consulting, software development, and business outsourcing services.
Hands-on Boomi AtomSphere integration design/development, REST/SOAP/XML/JSON and flat file experience, ability to design solution architecture and lead large data migrations; bachelor\u0002s degree or equivalent experience; must be authorized to work in the US without employer sponsorship.
Boomi AtomSphere, Boomi, REST, SOAP, XML, JSON, CSV, iPaaS, Cloud Integration and API Management, TIBCO, Vitria, webMethods, IBM WBI, SAP NetWeaver