11 packaging designer jobs at 6 companies in Longview, WA
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Senior Designer
Portland, Oregon, United States
OnsiteFull Time
10+ YOE10+ years professional design experience; strong portfolio in branding, packaging, merchandise; expert Adobe Creative Cloud; presentation, communication, project management skills.
Adobe Creative Cloud, SketchUp, Fusion 360
3d
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Structural Designer
Hillsboro, Oregon, United States
$50k-$70k/yr HybridFull Time
1+ YOEHigh school or associate degree in architectural design, engineering design, or drafting; 1–2+ years using AutoCAD or Revit for engineering or architectural design packages; industrial design experience preferred.
AutoCAD, Revit, BIM, AI Large Language Models
3d
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Instrumentation & Controls Designer
Hillsboro, Oregon, United States
$80k-$100k/yr HybridFull Time
10+ YOEAssociate degree or equivalent technical training, approximately 10 years of I&C design experience, and independent design-package production. Requires AutoCAD, Revit, PLC/DCS knowledge, diagram interpretation, and code familiarity.
AutoCAD, Revit, Navisworks, PLC, DCS, BAS, UPS, P&IDs, HVAC, OEMs, AI Large Language Models
3w
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Hardware Designer, Sr
Bengaluru or Portland
HybridFull Time
4+ YOE4+ years creating medium/high complexity CAD models and assemblies in Unigraphics-NX, producing drawing packages for sheet metal, machined parts and weldments, applying DFM/DFA, and mentoring designers.
Unigraphics-NX, Team Center, SAP, PLM, Microsoft Excel, Microsoft Word, Microsoft PowerPoint
3w
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Silicon Packaging Design Engineer
Phoenix or Hillsboro or Chandler
$164k-$232k/yr OnsiteFull Time
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
Cadence Allegro, Cadence Constraint Manager, Siemens Xpedition, Product Lifecycle Management (PLM)
3mo
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Silicon Packaging Design Engineer
Phoenix or Hillsboro
$106k-$200k/yr OnsiteFull Time
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
Virtuoso, Innovus, FusionCompiler, ICvalidator, Calibre
1mo
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Creative Director
Portland, Oregon, United States
OnsiteFull Time
7+ YOE7+ years creative experience with leadership, strong portfolio in packaging and production, expertise in creative operations, knowledge of structural packaging and print production, Adobe Creative Cloud proficiency, Mac/Windows experience, and excellent communication skills.
Adobe Creative Cloud, Mac, Windows
2w
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Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yr HybridFull Time
12+ YOEBS, MS, or PhD in electrical engineering, physics, or computer engineering; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional system-manufacturing design.
AI
3d
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Director of Package Design
Mountain View or Redmond or Hillsboro or Austin or Raleigh
$143k-$275k/yr HybridFull Time
3+ YOERequired: doctorate plus 3+ years, master's plus 6+ years, bachelor's plus 8+ years, or equivalent. Preferred: 15+ years semiconductor package experience and advanced packaging, CAD, simulation, supplier, and manufacturing expertise.
Cadence Allegro, EDA, BGA
4w
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Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
5d
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Signal and Power Integrity Engineer
Raleigh or Redmond or Austin or Hillsboro or Mountain View
$102k-$202k/yr HybridFull Time
1+ YOEMaster’s degree plus 1+ year or bachelor’s degree plus 2+ years in technical engineering; 5+ years of signal and power integrity, system design, electrical modeling, or silicon packaging experience preferred.