AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yrHybridFull Time
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
12+ YOE3+ MgmtManage and develop engineers for flip-chip-BGA package designs; requires 12+ years package design experience, 3+ years management, Ohio? (not stated), knowledge of SI/PI, project management and cross-functional collaboration.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Signal and Power Integrity Senior Application Engineer
San Jose, California, United States
$84k-$156k/yrOnsiteFull Time
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
1+ YOEBachelor's or Master's in Electrical/Electronics Engineering, 1+ years related experience, strong background in signal, power, and electromagnetics for package and PCB design, excellent communication and presentation skills.
Efficient Computer: Developing ultra-low-power general-purpose processors for edge AI computing.
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
Program Management Lead - SoC Execution and Customer Engagements
Bengaluru or San Francisco or San Jose
OnsiteFull Time
TylSemi: Building chiplet-native infrastructure for high-performance AI systems.
15+ YOERequires 15+ years in technical program or project management within semiconductor, custom silicon, or advanced packaging environments, plus silicon execution, ecosystem partner, and SoC design-flow experience.
Headway Technologies: Designs and manufactures magnetic recording heads for hard disk drives
2+ YOEMaster’s degree in optical or electrical engineering, applied physics, or equivalent experience; 2+ years in optics or related fields; optical testing, laser package design, modeling, simulation, and failure analysis experience.
Lumerical, Tidy3D, COMSOL, Claude, ChatGPT, TEM, EELS, EDS, SIMS, XPS, Microsoft Office
Signal Integrity & Power Integrity Principal Engineer
San Jose, California, United States
$187k-$270k/yrOnsiteFull Time
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
15+ YOE15+ years SI/PI experience; Bachelor's in Electrical/Computer Engineering; expertise in SI/PI for silicon/package/board; strong with HFSS/HSPICE/Sigrity/ADS; scripting in Python/MATLAB; design tool experience
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yrOnsiteFull Time
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.